Shares of ASMPT (HKEX: 00522) are currently up more than 9%. At the time of writing, the stock has risen 9.3% to HK$185.7, with a turnover of HK$869 million.

This movement follows the company's announcement that it has secured a follow-on order from a globally leading integrated device manufacturer (IDM). The order is for eight thermal compression bonding (TCB) systems intended for chip-to-wafer (C2W) applications.

As the era of heterogeneous computing drives demand for higher performance and integration, chiplet-based architectures are becoming increasingly widespread. These TCB systems will support the IDM in producing advanced client and data center CPUs.

An industry research report highlights that the shortage of HBM modules for high-end, large-scale computing GPUs remains a core capacity bottleneck in the AI supply chain. According to disclosures from SK Hynix management, the global shortage of memory chips may persist until 2030. In response, major global memory manufacturers are accelerating their capacity expansion plans, which is expected to bring forward significant demand for production equipment and materials.

Calculations suggest that, under full production capacity, the global demand for new TCB equipment to support HBM production from 2026 to 2028 is estimated at 532, 648, and 748 units, respectively. The report notes that as global memory giants speed up their expansion, the procurement demand for TCB equipment is climbing, with ASMPT positioned as a key beneficiary.