On June 11, ASMPT rose 3.3% in regular trading, trading at 179.6 HKD/share, with trading volume of HKD 98.36 million. The stock extended its rebound following a significant new order announcement.

On the news front, ASMPT recently announced it has secured an additional order from a global leading integrated device manufacturer (IDM) for eight thermocompression bonding (TCB) systems to support chip-to-wafer (C2W) applications. These systems will be deployed for the production of advanced client and data center CPUs, driven by growing demand for chiplet-based architectures in the heterogeneous computing era.

Institutional research highlights that global memory giants are accelerating capacity expansion, with HBM module shortages remaining a core bottleneck in the AI supply chain. Under full production scenarios, global HBM production is estimated to require 532/648/748 new TCB equipment units from 2026 to 2028, positioning ASMPT as a key beneficiary. The stock had previously declined over 6% from early June following the completion of its ASMPT NEXX subsidiary divestiture to Applied Materials for USD 120 million, which narrowed the company's SEMI segment product portfolio.

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