In an announcement, Hubei Dinglong Co.,Ltd. (ASX: 300054) stated that to capitalize on industry opportunities such as semiconductor industry upgrades, glass substrate technology iteration, and large-diameter substrates, the company aims to solidify its core advantage in semiconductor CMP polishing pads, improve its product portfolio, and enhance long-term operational value and overall competitiveness. Its wholly-owned subsidiary, Hubei Dinglong Huisheng New Materials Co., Ltd., a unit of Hubei Dinghui Microelectronics Materials Co., Ltd., intends to soon initiate the construction project for a third soft polishing pad production line in the Qianjiang industrial park. The project will focus on two high-end product directions: glass substrate CMP polishing pads and large-size (diameter greater than 2 meters) polishing pads. The planned annual production capacity is 300,000 pieces, with a total project investment of 30 million yuan. It is expected to be completed and operational by the end of 2026.