Taiwan Semiconductor Manufacturing, which has been mass-producing 3nm process technology for over two years, is advancing the production of its more advanced 2nm process technology. Chairman and CEO C.C. Wei has indicated during analyst conference calls in recent quarters that the company is proceeding on schedule to begin mass production in the second half of this year.

Similar to previous process nodes including 7nm, 5nm, and 3nm technologies, Taiwan Semiconductor Manufacturing's 2nm process is expected to achieve substantial production capacity following mass production. According to reports, the company's 2nm process technology will be manufactured at the Baoshan fab in Hsinchu Science Park and the fab in Kaohsiung's Nanzih district. By the end of this year, the combined monthly capacity of both facilities is projected to reach 45,000 to 50,000 wafers.

Reports further indicate that following large-scale mass production, Taiwan Semiconductor Manufacturing's 2nm process capacity will continue to expand. The combined monthly capacity for this process technology at both facilities is expected to exceed 100,000 wafers next year.

Once monthly capacity surpasses 100,000 wafers, Taiwan Semiconductor Manufacturing's ability to meet customer demand for its 2nm process technology will be enhanced, enabling the company to secure additional client orders.

Regarding Taiwan Semiconductor Manufacturing's 2nm process clients, initial customers are reported to include Apple, AMD, Broadcom, MediaTek, Intel, and Qualcomm, with major client Apple expected to receive nearly half of the production capacity.