Taiwan Semiconductor Manufacturing and Sony Semiconductor Solutions have announced a joint venture to develop and manufacture next-generation image sensors. Sony plans to invest approximately 465 billion yen through cash contributions and asset transfers from a company split, while Taiwan Semiconductor Manufacturing will contribute around 282 billion yen in cash.

These investments will be phased based on market demand and other business conditions. Beyond the funds from Sony and Taiwan Semiconductor Manufacturing, the investments required to achieve the joint venture's capacity planning are contingent upon receiving support from the Japanese government. The joint venture will utilize advanced process technology as a core hub for the development and manufacturing of image sensors for smartphones, with mass production expected to begin in 2029.

The establishment of the joint venture and the completion of the transaction are subject to obtaining necessary regulatory approvals and following standard transaction practices.