TIANYU SEMI (02658) announced its annual results for the period ended December 31, 2025. The Group recorded revenue of RMB709 million, representing an increase of 36.49% compared to the previous year. The loss attributable to the company's equity shareholders was RMB55.605 million, narrowing by 88.71% year-on-year. The loss per share was RMB0.15.

The increase in revenue was primarily driven by a volume-driven sales strategy, which led to a significant rise in sales volume, particularly for 6-inch and 8-inch silicon carbide epitaxial wafers. This positive effect was partially offset by a decrease in the average selling price of these wafers. Additionally, revenue from services such as foundry operations contributed to the growth.

In terms of core technology during the fiscal year, the company utilized 4H-SiC thick-film rapid epitaxial growth technology and continued to focus on the industrialization of silicon carbide epitaxial wafers. To meet evolving customer demand for larger-sized, more cost-effective materials, TIANYU SEMI concentrated on improving the stability and yield of its 8-inch silicon carbide epitaxial wafers and committed to their mass production. Compared to smaller wafers, 8-inch wafers offer a larger chip cutting area, a reduced proportion of edge loss, and higher utilization of effective area per wafer.

Regarding production capacity, the company's new production base in the Dongguan Eco-Park has commenced operations. This development establishes TIANYU SEMI as one of China's leading manufacturers with large-scale production capacity for both 6-inch and 8-inch epitaxial wafers.