On September 29, CSOP Samsung Electronics Daily (2x) Leveraged Product rose 6.29% in regular trading.

On the news front, NVIDIA CEO Jensen Huang met with Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Chey Tae-won in New York on September 28, with next-generation HBM memory cooperation as the key focus. Samsung is reportedly accelerating its long-term partnership with NVIDIA on HBM4E and HBM5, while the meeting also covered foundry services and advanced packaging. Earlier reports indicated Samsung plans to boost outsourced glass substrate cleaning volumes from 20,000 wafers per month to 50,000 per month — a 2.5x increase — suggesting HBM4 and HBM4E output could at least double next year. Samsung's overall HBM monthly wafer starts are projected to rise from approximately 180,000 to 250,000, a nearly 40% expansion.

As a daily 2x leveraged product, it aims to deliver investment results that closely correspond to twice the daily performance of Samsung Electronics ordinary shares listed on the Korea Exchange before fees and expenses. The product does not seek to achieve its stated investment objective over a period exceeding one day.

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