ASMPT (00522) rose more than 4%, reaching a gain of 3.73% at the time of writing to trade at HK$175.2, with a turnover of HK$145 million. Recently, ASMPT announced that its indirect wholly-owned subsidiary, ASMPT USA Holding, Inc., has entered into a share purchase agreement with Applied Materials, Inc. to sell all of its ordinary share capital in ASMPT NEXX, Inc., with the transaction set for completion by April 30, 2026. The announcement stated that, based on strategic business integration considerations, the group has decided to divest the target company from its semiconductor solutions segment through this sale. This move is intended to help the group further concentrate its focus on back-end packaging operations. Huaxin Securities noted that SK Hynix and Samsung Electronics are actively expanding their HBM production capacity. SK Hynix has moved up the operational start date for the first fab in its Yongin cluster to February 2027, while Samsung plans to invest 110 trillion won to support HBM4 and hybrid bonding technology. In the high-end memory sector, ASMPT's TCB equipment has been procured by SK Hynix for the mass production of HBM4. The company previously secured a bulk order for over 30 units for 12-layer HBM3E production and has recently received an additional order for TCB equipment valued at approximately 300 billion won, with individual units priced around 40 billion won.