Shares of the CSOP Leveraged Samsung Electronics product (07747) climbed more than 4% in Thursday trading, last up 4.26% at HK$77.32 with turnover reaching HK$486 million.

At the recent Hot Chips technology conference, Sangwook Han from Samsung's DRAM design team delivered a presentation formally outlining the company's three-phase roadmap for HBM evolution. The plan culminates in a groundbreaking architecture called zHBM, which stacks DRAM directly vertically atop computing chips such as GPUs and TPUs, eliminating the need for a 2.5D interposer layer entirely.

Samsung claims that compared with standard HBM4E, the zHBM approach delivers a 70% reduction in power consumption, a 230% increase in DRAM bandwidth, and saves 100W per DRAM module, while also freeing up an additional 8.3% of power headroom for the GPU.