On July 13, ASMPT rose 3.89% in regular trading, trading at 192.0 HKD/share, with turnover of 109 million HKD. The stock continued its technical rebound after correcting over 18% from its June 30 all-time high of 232 HKD.

On the news front, industry sources indicated that HBM4 memory prices could double from approximately $2/GB in the second half of this year to $4-5/GB by next year, driven by surging AI demand and structural capacity bottlenecks. HBM4 production cycles of four to six months with low initial yields, combined with wafer consumption roughly three times that of standard DDR5, severely constrain output. Samsung, SK Hynix, and Micron are locking in supply through three-to-five-year agreements with top AI clients, with roughly half of global DRAM capacity potentially unavailable to smaller buyers by next year.

ASMPT, as the leading supplier of thermal compression bonding (TCB) equipment essential for HBM production, stands as a direct beneficiary. Citi previously raised its target price to 250 HKD, citing ASMPT's dominant position in TCB and advanced packaging solutions amid accelerating industry capital expenditure. Additionally, major memory producers including Chang Xin Technology and SK Hynix are advancing large-scale IPO fundraising dedicated to capacity expansion, further underpinning equipment order visibility.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)