On June 25, FIT Hon Teng fell 3.05% in regular trading, trading at HKD 7.34 per share, with turnover of HKD 121 million.

On the news front, the ongoing dispute over CPO (Co-Packaged Optics) mass production timelines continues to pressure the stock. A SemiAnalysis report previously suggested CPO scaled production could be delayed to 2028 or even 2029. Although NVIDIA's networking senior vice president publicly rebutted the claim, confirming that Spectrum-X Ethernet CPO switch production will proceed as planned in the second half of this year, market divergence remains unresolved. Industry sources indicate the real bottleneck lies in upstream indium phosphide laser chip capacity rather than outright delays, with markets having confused small-batch validation timelines with full-scale industry adoption.

FIT Hon Teng has retreated over 30% from its June 3 high, with its dynamic P/E ratio of approximately 46x still far exceeding the electronic components industry average. Combined with the chairman's prior share disposal at an average price of approximately HKD 10.05, profit-taking and trapped-position selling pressure resurfaced after brief technical rebounds earlier this week.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)