ANDRE JUICE Plans Partial Acquisition of Stake in Yongqiang Technology from Key Shareholders

Stock News
06/15

ANDRE JUICE (02218) has announced that its board of directors, during its tenth meeting of the ninth session held on June 15, 2026, reviewed and approved a proposal to sign an equity transfer framework agreement.

The agreement concerns the company's plan to use its own or self-raised funds to acquire a portion of the equity in Ningbo Yongqiang Technology Co., Ltd. from its shareholders JIANGQI HE, QIANG YUAN, and Ningbo Yuanluzai Technology Partnership Enterprise.

The shareholders have agreed to assist the company in communicating with other shareholders of the target company regarding the equity transfer, with the ultimate goal of achieving the acquisition of a controlling stake in the target company.

Securing control of the target company is a prerequisite for this transaction. The total consideration for the deal is preliminarily estimated to be between 600 million and 800 million yuan, with the final valuation to be confirmed. This transaction is not initially expected to constitute a major asset restructuring.

The target company is a high-tech enterprise specializing in the research and development, production, and sales of electronic information interconnection materials for integrated circuits.

It has established an annual production capacity of 10 million square meters for high-speed, high-frequency, and BT substrate electronic interconnection materials at an integrated circuit industry cluster base in Beilun District, Ningbo.

The company has developed a closed-loop ecosystem encompassing design, packaging, systems, and substrate materials. Its direct customers include companies such as Shenghong Technology, Shennan Circuits, Wus Printed Circuit, Shengyi Electronics, Founder Technology, Guanghe Technology, Xingsen Technology, and Yueya Semiconductor.

End customers include Inspur Information, Sugon, H3C, and Zhongji Innolight, among others.

The company's main products are electronic information interconnection materials, which include copper-clad laminates and prepregs.

A copper-clad laminate is a board-like material made by impregnating electronic fiberglass cloth or other reinforcing materials with resin, covering one or both sides with copper foil, and then hot-pressing it. It is characterized by good dielectric and mechanical properties.

The complementary prepreg is a crucial semi-finished product in the laminate production process, formed by combining resin and reinforcing materials through specialized techniques.

Electronic information interconnection materials are core components for manufacturing printed circuit boards. Printed circuit boards, which serve as carriers for the electrical connection of electronic components, are vital parts of modern electronic information products.

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