Huaqin Technology Co., Ltd. has announced that its public offering of corporate bonds with a total face value not exceeding RMB 2 billion (including RMB 2 billion) to professional investors has received approval from the Shanghai Stock Exchange and registration consent from the China Securities Regulatory Commission (Approval No. 2327 [2025]). The second tranche of the 2026 Science and Technology Innovation Corporate Bonds, also targeted at professional investors, will have a term of three years and an issuance scale not exceeding RMB 1.2 billion (including RMB 1.2 billion). On April 29, 2026, the issuer and lead underwriter conducted a book-building process to determine the coupon rate with professional institutional investors offline. Based on the results of this process and after full consultation and prudent judgment, the coupon rate for this bond issue (Bond Abbreviation: 26 Huaqin K2, Code: 245153.SH) has been finalized at 1.80%. The issuer will proceed with the offline issuance to professional institutional investors from April 30, 2026, to May 6, 2026, using this determined coupon rate.