Sealand Securities Co., Ltd. has released a research report indicating that the optical chip coupling sector has developed into three mature technical routes: grating coupling, edge coupling, and hybrid coupling (combining grating and edge). As silicon photonic chips evolve towards higher integration and multi-channel functionality, active alignment, which relies on real-time optical power feedback, is gradually replacing passive alignment that depends on mechanical positioning accuracy. The report suggests that optical module equipment is driven by both technological upgrades and capacity expansion, leading to a sustained improvement in the industry's prosperity. The firm maintains a "recommended" rating for the optical module equipment sector.
The three main technical routes for optical chip coupling—grating, edge, and hybrid—each serve different purposes. Grating coupling is suitable for wafer-level parallel and rapid testing. Edge coupling, offering advantages such as high coupling efficiency, large bandwidth, and polarization insensitivity, is the mainstream packaging method for high-speed optical modules. Hybrid coupling, which balances testing convenience with high performance, has already been applied in mass production for 400G and 800G silicon photonic chips.
Optical module coupling is a critical packaging process that determines the performance, yield, and production efficiency of the modules. As light undergoes scattering, refraction, and reflection during spatial propagation, it cannot be transmitted stably along conductors like electrons. Therefore, the light source from the laser chip must be transmitted through optical fibers. Optical module coupling is categorized into direct and indirect coupling methods.
Active alignment is increasingly becoming a key technical route for manufacturing high-end optical modules. With the trend towards higher integration and multi-channel capabilities in silicon photonic chips, active alignment, which uses real-time optical power feedback, is replacing passive alignment that depends on mechanical positioning accuracy. This method employs high-precision motion platforms to drive components in movements ranging from micrometers to nanometers, continuously collecting optical power feedback to optimize positioning. This process effectively compensates for manufacturing and assembly errors, enhancing coupling efficiency, production efficiency, and product yield.
The growing demand for AI optical modules is expected to continue driving expansion in the coupling equipment market. Driven by the need for large model training and inference, the AI optical module market is rapidly growing, leading to a sustained increase in demand for optical module coupling equipment. According to Frost & Sullivan, the global optical coupling equipment market was valued at 2.31 billion yuan in 2025, and it is projected to grow to 15.08 billion yuan by 2030.
The global coupling equipment market features a concentrated competitive landscape, with leading players and accelerating development from domestic Chinese manufacturers. In 2024, the top three manufacturers in the global optical module coupling equipment market accounted for a combined 56% market share. Raion Technology, Lie-Qi Intelligence, and ficonTEC held the top three positions, with market shares of 27%, 18%, and 11%, respectively. Companies such as Bozhon Precision Industry Technology Co., Ltd. and Shenzhen Colibri Technologies Co., Ltd. are also actively entering the optical module coupling equipment space. Related companies include LianXun Instruments, Unicomp Technology, Colibri Technologies, Huashengchang, Robot Technology, Kaige Precision Equipment, Bozhon Precision, Autowell Technology, Anda Intelligent, Quick Intelligent, and Zhifang Technology.
Risk warnings: Risks include technology maturity not meeting expectations, uncertainty in the industrialization and implementation of new technologies, long early-stage investment cycles and potential project execution delays, changes in the market competitive landscape, and shifts in the policy environment.