YONGDA AUTO signs strategic framework with Hongxin Electronics to build computing-power and data joint ventures for embodied-intelligence rollout

Bulletin Express
07/15

According to the 15 July 2026 announcement, YONGDA AUTO (stock code 03669) entered into a Strategic Cooperation Framework Agreement with Xiamen Hongxin Electronics Technology Group Inc. to establish a long-term partnership focused on embodied-intelligence commercial applications.

The agreement outlines three progressive collaboration phases:

1. Computing-power joint venture • Both parties will co-invest in an operating entity dedicated to building and running computing clusters for embodied-intelligence large-model developers, robotics makers and related industrial customers. • Revenue is expected to derive from providing computing resources, technology services and integrated solutions, with Hongxin Electronics and its affiliates positioned as priority suppliers of hardware and services on equivalent commercial terms.

2. Data-service joint venture • A second joint venture will concentrate on data collection, annotation, quality inspection, training support and validation tailored to embodied-intelligence model requirements. • Commercialisation will target large-model enterprises, robotics companies and downstream industrial clients once initial projects demonstrate viability.

3. Downstream embodied-intelligence services • Subject to the stable growth of the computing-power and data businesses, the partners will further explore deployment of large models, scenario applications, end-user sales, leasing, delivery and life-cycle operations.

Strategic rationale The board of YONGDA AUTO views the alliance as a catalyst for entering the embodied-intelligence services market while maintaining its core automotive sales and after-sales platform. Hongxin Electronics contributes chip-to-server integration, green-energy support, cluster construction, resource scheduling and a national AI ecosystem, allowing YONGDA AUTO to supplement infrastructure, technology and talent.

Implementation status The framework is non-binding; specific capital contributions, governance structures and financial arrangements will be finalised in separate legally binding agreements after due diligence. Any resulting transactions that trigger Hong Kong Listing Rules requirements will be subject to further disclosure and, where necessary, shareholder approval.

Counterparty profile Hongxin Electronics, listed on the ChiNext Board of the Shenzhen Stock Exchange (300657.SZ), specialises in high-precision flexible printed circuits, AI computing hardware manufacturing and computing-power leasing. The company and its ultimate owners are independent third parties to YONGDA AUTO.

The announcement stresses that the framework positions YONGDA AUTO to build foundational computing-power and data capabilities, laying the groundwork for long-term participation in the embodied-intelligence economy and potential enhancement of shareholder value.

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