CHENGDU EXPWAY (01785) Plans to Issue Up to RMB500 Million Corporate Bonds

Stock News
2025/12/10

CHENGDU EXPWAY (01785) announced its plan to issue the first tranche of its 2025 Rural Revitalization Corporate Bonds (Chengdu-Chongqing Economic Circle) targeting professional investors. The issuance period is set from December 12 to December 15, 2025, with a total offering size not exceeding RMB500 million (inclusive). The bonds will have a 5-year maturity, a par value of RMB100, and will be issued at par. Proceeds from the bond issuance will be allocated for equity investments.

免責聲明:投資有風險,本文並非投資建議,以上內容不應被視為任何金融產品的購買或出售要約、建議或邀請,作者或其他用戶的任何相關討論、評論或帖子也不應被視為此類內容。本文僅供一般參考,不考慮您的個人投資目標、財務狀況或需求。TTM對信息的準確性和完整性不承擔任何責任或保證,投資者應自行研究並在投資前尋求專業建議。

熱議股票

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10