On June 24, ASMPT rose 3.13% in regular trading, trading at 201.0 HKD/share, with turnover of 189 million HKD. The stock is stabilizing and rebounding after experiencing profit-taking pressure during June 22-23 sessions.

On the news front, the rebound is supported by continued catalysts including global memory manufacturers accelerating capacity expansion and ASMPT securing additional orders of eight thermal compression bonding (TCB) systems from a leading integrated device manufacturer for advanced CPU production. Institutions estimate the global TCB market will grow from approximately USD 760 million to USD 1.6 billion by 2028, representing a three-year CAGR of 28%, with ASMPT targeting a 35-40% market share. The stock had previously surged over 12% on June 15 and climbed further to above 207 HKD on June 17 before retreating. Current price action suggests multi-directional positioning is reaching equilibrium as the optical interconnect industry chain enters an expansion cycle, providing additional demand visibility for bonding equipment.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)