On February 9, Montage Technology Co., Ltd., a global leader in memory interconnect chips, will list its H-shares on the Hong Kong Stock Exchange. The company has set its offering price at HK$106.89 per share, issuing 65,890,000 H-shares globally and raising approximately HK$6.9 billion in net proceeds. China International Capital Corporation, Morgan Stanley, and UBS are serving as joint sponsors.

Montage Technology has garnered strong recognition from the capital markets, with its Hong Kong public offering oversubscribed by more than 700 times, attracting over 260,000 individual investors. Nineteen prominent cornerstone investors, including J.P. Morgan and UBS, actively participated, collectively subscribing to US$450 million worth of shares, accounting for 49.82% of the total offering.

The company holds a robust market position, possessing the authority to set international standards for DDR5 technology. As a key supplier of core interconnect chips for AI servers, Montage Technology commands a 50% market share in the DDR5 segment, ranking first globally.

Currently, only three companies worldwide are capable of mass-producing DDR5 memory interface chips. Montage Technology maintains deep collaborations with leading global memory manufacturers such as Samsung and SK Hynix. Its proprietary technology leads competing products by more than six months, and the company reported a net profit growth exceeding 50% in the first nine months of 2025, highlighting its strong profitability.