On July 10, Biren Technology rose 3.82% in regular trading, trading at HK$49.56 per share, with turnover of approximately HK$105 million. The stock continued its multi-day rebound following the completion of a major share placement.

On July 8, the company completed the placement of 153 million new H shares at HK$46.20 each, raising net proceeds of approximately HK$7.038 billion. The placement price represented a discount of roughly 9.94% to the July 3 closing price of HK$51.30, while diluting existing shareholders by approximately 6.27%. The stock initially plunged 9.36% on July 6 in response but has since found support near the placement price and staged a consecutive-day recovery, now firmly above the HK$46.20 level.

Post-placement, total issued shares increased to approximately 2.59 billion. The company stated approximately 60% of proceeds will fund acceleration of next-generation GPGPU product commercialization and production, with roughly 20% earmarked for advanced technology R&D, aiming to capture expanding AI computing demand.

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