On June 25, ASE Technology rose 5.66% overnight, trading at $43.5/share, with turnover of $58,700.

On the news front, the company disclosed a massive expansion plan following its shareholder meeting. ASE and its subsidiary SPIL are collectively undertaking approximately 15 new construction and expansion projects. Additionally, the company plans to build two new factories in California on top of its existing two test facilities and is evaluating investment in Arizona driven by U.S. client demand. The company also confirmed that its first fully automated Fan-Out Panel-Level Packaging (FOPLP) mass production line is scheduled to commence operations by year-end. CEO Wu Tianyu indicated that second-half performance may exceed expectations, noting that many clients are following NVIDIA and AMD in expanding investment in Taiwan.

Fundamentally, ASE reported May consolidated revenue of NT$63.033 billion, a 29% year-over-year increase, with packaging, testing, and materials revenue surging 38% YoY to NT$42.162 billion, reflecting robust advanced packaging demand. The company has raised its capital expenditure target to $8.5 billion for the second time, positioning itself as a key node in the AI supply chain as TSMC advanced packaging overflow orders continue. Within the Semiconductors sector, Micron Technology rose 15.59%, Intel rose 5.15%, and AMD rose 3.17%.

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