SK hynix announced on Friday that it has showcased its next-generation artificial intelligence (AI) memory technologies, aiming to extend the boundaries of AI infrastructure beyond conventional high-bandwidth memory (HBM).

The company unveiled these technologies at the OCP Global Summit 2026, held from Tuesday to Thursday local time in California in the United States. The summit is an annual conference organized by the Open Compute Project (OCP) Foundation, bringing together engineers and industry leaders.

The South Korean chip giant said its exhibition area was divided into two sections. The front section, called the "Storage Pavilion," displayed the company's flagship products, while the larger rear section, named the "System Demonstration Zone," highlighted memory solutions designed to support next-generation server ecosystems.

Kim Ho-sik, Senior Vice President of SK hynix (SKHY), introduced MARS (Memory-Centric AI Rack-Scale System), a disaggregated rack-scale architecture designed to enable seamless coordination between computing resources and memory resources.

Kim highlighted the progress achieved in High Bandwidth Flash (HBF), a technology aimed at meeting the industry's growing demand for memory capacity.

In addition, the company also released its second-generation 256GB storage product based on the Compute Express Link (CXL) 3.2 standard. Compared with the previous generation, this product more than doubles bandwidth and improves energy efficiency by approximately 30%.