ASMPT's stock surged 5.99% during intraday trading on Monday, extending its recent upward momentum.

The semiconductor equipment maker is benefiting from multiple positive catalysts. The company recently announced the strategic divestiture of its U.S. subsidiary ASMPT NEXX to Applied Materials for $120 million in cash, allowing it to shed lower-margin front-end deposition equipment operations and sharpen its focus on the core back-end advanced packaging business.

Furthermore, ASMPT reported robust first-quarter financial results, with adjusted profit soaring 193.5% year-over-year to HKD 335 million on revenue of HKD 3.97 billion, a 32.0% increase, both exceeding market expectations. The company has also secured significant orders worth approximately KRW 30 billion from SK Hynix for its Thermal Compression Bonding (TCB) equipment, which is critical for HBM4 mass production. Analysts highlight ASMPT's strategic positioning in the AI chip advanced packaging supply chain as a key growth driver.