The Administrative Committee of the Beijing Economic-Technological Development Area has issued the "Implementation Plan for Further Accelerating the Construction of a City-Wide Artificial Intelligence Hub (2026–2027)." The document emphasizes strengthening native intelligent foundational capabilities. Leveraging advantages in integrated circuit manufacturing, the plan aims to promote integrated and coordinated development across the "design-manufacturing-packaging/testing-computing power" chain, driving continuous iteration of computing infrastructure and the high-performance intelligent computing industry.

It will advance research, development, and innovation in chip architectures such as mixed-signal and memory-centric computing, while extending industry chains that include scenario-defined chips, industry-specific chips, and enabling software. The plan also calls for promoting the coordinated development of general-purpose and vertical-specific models and accelerating the iterative upgrade from cognitive models to agentic models.

Support will be provided for the construction of national-level AI hardware and software testing and verification centers, as well as large model evaluation centers, to solidify the underlying capability of "chip-model co-adaptation." An active deployment of an artificial intelligence security system is planned, with a focus on making breakthroughs in technologies such as deepfake identification and generated content compliance detection, thereby building a secure and trustworthy foundation.