Marvell Demonstrates Industry's Leading 2nm Silicon for Accelerated Infrastructure

PR Newswire

03-03

The Marvell® 2nm platform will enable hyperscalers to dramatically boost the performance and efficiency of their infrastructure to meet the performance and efficiency demands of the AI era. Built on ...

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{"basename":"/hant","ssrTDKData":{"titleTemplate":"%s - 老虎證券","title":"老虎证券全球投资理财平台| 一站式投资美股新股港股A股","description":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","keywords":"老虎證券,老虎證券開戶,老虎券商,老虎證券官網,老虎證券app,tigertrade老虎證券,股票,炒股,新加坡股票交易平臺,投資,投資理財","social":{"ogDescription":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.be62fbe1.png","ogUrl":"https://www.itiger.com/hant/news/2516942639"},"companyName":"老虎證券"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"SGP","license":"TBSG","edition":"fundamental"},"__swrFallback__":{"@#url:\"https://stock-news.skytigris.cn/v3/news\",params:#id:\"2516942639\",edition:\"fundamental\",,,undefined,":{"share":"https://ttm.financial/m/news/2516942639?lang=zh_TW&edition=fundamental","thumbnail":"","is_english":true,"pubTime":"2025-03-03 22:00","share_image_url":"https://static.laohu8.com/5f26f4a48f9cb3e29be4d71d3ba8c038","id":"2516942639","market":"us","top_or_hot":-1,"title":"Marvell Demonstrates Industry's Leading 2nm Silicon for Accelerated Infrastructure","media":"PR Newswire","content":"<div>\n<p>The Marvell® 2nm platform will enable hyperscalers to dramatically boost the performance and efficiency of their infrastructure to meet the performance and efficiency demands of the AI era.\nBuilt on ...</p>\n\n<a href=\"https://finance.yahoo.com/news/marvell-demonstrates-industrys-leading-2nm-140000417.html\">網頁鏈接</a>\n\n</div>\n","source":"yahoofinance","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Marvell Demonstrates Industry's Leading 2nm Silicon for Accelerated Infrastructure</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nMarvell Demonstrates Industry's Leading 2nm Silicon for Accelerated Infrastructure\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">PR Newswire</strong><span class=\"h-time small\">2025-03-03 22:00</span>\n</p>\n</h4>\n</header>\n<article>\n<div>\n<p>The Marvell® 2nm platform will enable hyperscalers to dramatically boost the performance and efficiency of their infrastructure to meet the performance and efficiency demands of the AI era.\nBuilt on ...</p>\n\n<a href=\"https://finance.yahoo.com/news/marvell-demonstrates-industrys-leading-2nm-140000417.html\">網頁鏈接</a>\n\n</div>\n\n<div class=\"bt-text\">\n\n\n<p> 來源：<a href=\"https://finance.yahoo.com/news/marvell-demonstrates-industrys-leading-2nm-140000417.html\">PR Newswire</a></p>\n<p>為提升您的閱讀體驗，我們對本頁面進行了排版優化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU1852331112.SGD","symbol_name":"Blackrock World Technology Fund A2 SGD-H","start_time":0,"source_url":"https://finance.yahoo.com/news/marvell-demonstrates-industrys-leading-2nm-140000417.html","article_id":"2516942639","we_media_id":null,"thumbnails":[],"rights":{"source":"yahoofinance","url":"https://finance.yahoo.com/news/marvell-demonstrates-industrys-leading-2nm-140000417.html","rn_cache_url":null,"customStyle":"img, svg { display: none !important; }","selectors":"article","filters":"","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2516942639","pubTimestamp":1741010400,"columns":[],"sourceInfo":{"source_id":"yahoofinance","name":"雅虎金融"},"weMediaInfo":null,"summary":"The Marvell 2nm platform will enable hyperscalers to dramatically boost the performance and efficiency of their infrastructure to meet the performance and efficiency demands of the AI era.Built on TSMC's 2nm process, the silicon is a critical part of the Marvell platform for developing next-generation custom AI accelerators, CPUs, and networking.The silicon IP includes high-speed 3D I/O for vertically stacking die inside chiplets.SANTA CLARA, Calif., March 3, 2025 /PRNewswire/ --Marvell Technology, Inc. , a leader in data infrastructure semiconductor solutions,has demonstrated itsfirst 2nm silicon IP for next-generation AI and cloud infrastructure. Produced on TSMC's 2nm process, the working silicon is part of the Marvell platform for developing custom XPUs, switches and other technology to help cloud service providers elevate the performance, efficiency, and economic potential of their worldwide operations.Given a projected 45% TAM growth annually, custom silicon is expected to accoun","collect":0,"end_time":0,"defaultTopTitle":"yahoo.com","property":[],"viewcount":null,"language":"en","relate_stocks":{"LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","BK4543":"AI","LU1720051017.SGD":"Allianz Global Artificial Intelligence AT Acc H2-SGD","LU1861215975.USD":"贝莱德新一代科技基金 A2","LU0061475181.USD":"THREADNEEDLE (LUX) AMERICAN \"AU\" (USD) ACC","BK4588":"碎股","LU0786609619.USD":"高盛全球千禧一代股票组合Acc","BK4141":"半导体产品","LU2272731865.HKD":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AM\" (HKD) INC","LU1548497426.USD":"安联环球人工智能AT Acc","LU1861220033.SGD":"Blackrock Next Generation Technology A2 SGD-H","BK4605":"半导体精选","LU0127658192.USD":"EASTSPRING INVESTMENTS GLOBAL TECHNOLOGY \"A\" (USD) ACC","LU0154236417.USD":"BGF US FLEXIBLE EQUITY \"A2\" ACC","LU1303367103.USD":"摩根大通多经理另类基金 A (acc)","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","BK4581":"高盛持仓","BK4604":"机器人概念","LU1720051108.HKD":"ALLIANZ GLOBAL ARTIFICIAL INTELLIGENCE \"AT\" (HKD) ACC","LU2098885051.SGD":"JPMorgan Funds - Multi-Manager Alternatives A (acc) SGD","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU0187121727.USD":"FIDELITY SUSTAINABLE US EQUITY \"A\" (USD) INC","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","MRVL":"迈威尔科技","LU2357305700.SGD":"Allianz Global Artificial Intelligence ET H2-SGD","LU1119994496.HKD":"FIDELITY WORLD \"A\" (HKD) ACC","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","LU2244417387.USD":"FIDELITY SUSTAINABLE US EQUITY \"A\" (USD) ACC","LU2360107168.USD":"BGF NEXT GENERATION TECHNOLOGY \"A4\" (USD) INC","BK4168":"多种金属与采矿","LU2473716301.USD":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AMF\" (USD) INC","LU0056508442.USD":"贝莱德世界科技基金A2","LU2290526834.HKD":"BGF NEXT GENERATION TECHNOLOGY \"A2\" (HKDHDG) ACC","BK4515":"5G概念","LU1992135399.USD":"Allianz Global Intelligent Cities AT Acc USD","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","LU2272731782.SGD":"Allianz Global Intelligent Cities AM Dis H2-SGD","IE00BMPRXR70.SGD":"Neuberger Berman 5G Connectivity A Acc SGD-H","LU1084165304.USD":"FIDELITY WORLD \"A\" (USD) ACC","IE00BMPRXN33.USD":"NEUBERGER BERMAN 5G CONNECTIVITY \"A\" (USD) ACC","LU1261432733.SGD":"Fidelity World A-ACC-SGD","LU2272731600.USD":"Allianz Global Intelligent Cities AM Dis USD","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","LU1989764748.USD":"东方汇理环球颠覆性机遇A2 Acc","SG9999000418.SGD":"Aberdeen Standard Global Technology SGD","LU2322448791.USD":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AMG\" (USD) INC","LU1169589451.USD":"ALLSPRING (LUX)  U.S. SELECT EQUITY \"A\" (USD) ACC","BK4585":"ETF&股票定投概念","LU1992135472.HKD":"ALLIANZ GLOBAL INTELLIGENT CITIES \"AT\" (HKD) ACC","HBM":"HudBay Minerals Inc"},"translate_title":"Marvell展示业界领先的用于加速基础设施的2纳米硅","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"HBM":1,"MRVL":0.9},"content_text":"The Marvell® 2nm platform will enable hyperscalers to dramatically boost the performance and efficiency of their infrastructure to meet the performance and efficiency demands of the AI era.\nBuilt on TSMC's 2nm process, the silicon is a critical part of the Marvell platform for developing next-generation custom AI accelerators, CPUs, and networking.\nThe silicon IP includes high-speed 3D I/O for vertically stacking die inside chiplets. \n\nSANTA CLARA, Calif., March 3, 2025 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, has demonstrated its first 2nm silicon IP for next-generation AI and cloud infrastructure. Produced on TSMC's 2nm process, the working silicon is part of the Marvell platform for developing custom XPUs, switches and other technology to help cloud service providers elevate the performance, efficiency, and economic potential of their worldwide operations.\nGiven a projected 45% TAM growth annually, custom silicon is expected to account for approximately 25% of the market for accelerated compute by 20281.\nA Building Block Approach\nThe Marvell platform strategy centers around developing a comprehensive portfolio of semiconductor IP—including electrical and optical serializer/deserializers (SerDes), die-to-die interconnects for 2D and 3D devices, advanced packaging technologies, silicon photonics, custom high-bandwidth memory (HBM) compute architecture, on-chip static random-access memory (SRAM), system-on-chip (SoC) fabrics, and compute fabric interfaces such as PCIe Gen 7—that serve as building blocks for developing custom AI accelerators, CPUs, optical DSPs, high-performance switches and other technologies.\nAdvanced Technology Leadership\nStarting with the launch of the industry's leading 5nm data infrastructure silicon platform in 2020, Marvell has been at the forefront of developing products produced on advanced technology nodes to market. Marvell announced the industry's leading 3nm platform in 2022, with first silicon produced in 2023 and multiple industry standard and custom silicon products now shipping and in development.\n\"The platform approach enables us to accelerate the development of market-leading high-speed SerDes and other critical technologies on the latest process manufacturing nodes, which in turn enables Marvell and its customers to accelerate the development of XPUs and other accelerated infrastructure technologies,\" said Sandeep Bharathi, chief development officer at Marvell. \"Our longstanding collaboration with TSMC plays a pivotal role in helping Marvell develop complex silicon solutions with industry-leading performance, transistor density and efficiency.\"\nNew on the Marvell 2nm Platform\nAdditionally, Marvell delivered a 3D simultaneous bi-directional I/O operating at speeds up to 6.4 Gbits/second for connecting vertically stacked die inside of chiplets. Today, the I/O pathways connecting stacks of die are typically unidirectional. Shifting to a bi-directional I/O gives designers the ability to increase bandwidth by up to two times and/or reduce the number of connections by 50%.\n3D simultaneous bi-directional I/O will also give chip designers greater flexibility in design. Today's most advanced chips exceed the size of the reticle, or photomask, for outlining transistor patterns onto silicon. To increase transistor count, an estimated 30% of all advanced node processors are expected to be based around chiplet designs, where multiple chips are combined into the same package2. With 3D simultaneous bi-directional I/O, designers will be able to combine more die into increasingly taller stacks for 2.5D, 3D and 3.5D devices that provide more capabilities than a traditional monolithic silicon device while still functioning like a single device.\n\"TSMC is pleased to collaborate with Marvell on the development of its 2nm platform and the delivery of its first silicon,\" said Dr. Kevin Zhang, senior vice president of business development and global sales, and deputy co-chief operating officer at TSMC. \"We look forward to our continued collaboration with Marvell to utilize TSMC's best-in-class silicon technology process and packaging technologies to advance accelerated infrastructure for the AI era.\"\nAbout Marvell\nTo deliver the data infrastructure technology that connects the world, we're building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world's leading technology companies for over 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform—for the better.\nMarvell and the M logo are trademarks of Marvell or its affiliates. Please visit www.marvell.com for a complete list of Marvell trademarks. Other names and brands may be claimed as the property of others.\nThis press release contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events, results or achievements. Actual events, results or achievements may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, including those described in the \"Risk Factors\" section of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and other documents filed by us from time to time with the SEC. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise.\n1. Marvell IA Day, May 2024.\n2. Semiconductor Digest and Gartner, December 2024.\nFor further information, contact:pr@marvell.com\n\n\n\n\n\n View original content to download multimedia:https://www.prnewswire.com/news-releases/marvell-demonstrates-industrys-leading-2nm-silicon-for-accelerated-infrastructure-302389630.html\nSOURCE Marvell","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"code":"91000000","status":"200"}}}