Asahi Diamond Industrial (TYO:6140) will set up a joint venture with Tokyo Seimitsu (TYO:7729) to develop, manufacture and sell hub blades, a key component in dicing machines used for cutting silicon wafers, according to a Thursday filing on the Tokyo Stock Exchange.
The toolmaker will invest 500 million yen in the venture, which is slated to launch in May. The company name, location, leadership and shareholding structure are yet to be finalized.
The move aims to meet demand for fast delivery of customized hub blades.
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