應對H20被禁產能空缺：NVIDIA B300生產提速至5月

快科技官方

04-28

快科技4月28日消息，據報道，NVIDIA最新的B300芯片生產進度已提前至5月啓動，業界推測這一調整主要是應對H20芯片被禁導致的產能空缺。

供應鏈消息顯示，B300芯片將採用臺積電的5nm家族製程及CoWoS-L先進封裝技術，沿用了Bianca架構，零組件和ODM代工的學習曲線得以延續，有助於加快GB300芯片在今年底進入量產的進程。

臺積電南科的先進封裝AP8已於4月初開始進機，這似乎是爲了滿足B300芯片所採用的CoWoS-L封裝需求。

NVIDIA首席科學家Bill Dally在臺積電北美技術論壇上提到，B200芯片通過CoWoS封裝技術將兩個GPU集成在一起，突破了單一光罩尺寸的限制。

目前尚不確定B300芯片是否會在臺積電亞利桑那州晶圓廠同步生產，但由於美國仍缺乏CoWoS-L封裝能力，即便在美國生產，仍需回中國臺灣進行後段處理。

【本文結束】如需轉載請務必註明出處：快科技

責任編輯：黑白

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