MUMBAI, May 6 (Reuters) - India's Summit Digitel Infrastructure has accepted bids worth 14.75 billion rupees ($175 million) for bonds maturing in 15 years, two merchant bankers said on Tuesday.
The company, which provides infrastructure services to mobile network operators will pay a coupon of 7.31%, payable on a quarterly basis, and had invited bids from bankers and investors on Monday, they said.
The company did not reply to a Reuters email seeking comment.
Here is the list of deals reported so far on May 6:
Issuer | Tenure | Coupon (in %) | Issue size (in bln rupees)* | Bidding date | Rating |
Summit Digitel Infrastructure | 15 years | 7.31 (quarterly) | 14.75 | May 5 | AAA (Crisil, Care) |
APMDC | STRPP | To be decided | 20+70 | May 8 | AA- (Care) |
*Size includes base plus greenshoe for some issues
($1 = 84.2670 Indian rupees)
(Reporting by Dharamraj Dhutia; Editing by Sumana Nandy)
((Dharamraj.dhutia@tr.com))
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