MUMBAI, May 5 (Reuters) - India's Summit Digitel Infrastructure plans to raise 14.75 billion rupees ($174.7 million) through the sale of bonds maturing in 15 years, two merchant bankers said on Monday.
The company, which provides infrastructure services to mobile network operators, has invited bids from bankers and investors later in the day, they said.
The company did not immediately reply to a Reuters email seeking comment.
Here is the list of deals reported so far on May 5:
Issuer | Tenure | Coupon (in %) | Issue size (in bln rupees)* | Bidding date | Rating |
Summit Digitel Infrastructure | 15 years | 7.31 (quarterly) | 14.75 | May 5 | AAA (Crisil, Care) |
*Size includes base plus greenshoe for some issues
($1 = 84.4330 Indian rupees)
(Reporting by Dharamraj DhutiaEditing by Sonia Cheema)
((Dharamraj.dhutia@tr.com))
免責聲明:投資有風險,本文並非投資建議,以上內容不應被視為任何金融產品的購買或出售要約、建議或邀請,作者或其他用戶的任何相關討論、評論或帖子也不應被視為此類內容。本文僅供一般參考,不考慮您的個人投資目標、財務狀況或需求。TTM對信息的準確性和完整性不承擔任何責任或保證,投資者應自行研究並在投資前尋求專業建議。