Hanmi Semiconductor Launches TC BONDER 4 for HBM4 AI Chip Production

MT Newswires Live

2025/05/16

Hanmi Semiconductor (KRX:042700) launched the TC BONDER 4 on Wednesday, a purpose-built equipment for next-generation AI semiconductors using HBM4 memory, the chipmaker said in a press release the same day.

The equipment will be used in NVIDIA's upcoming Blackwell Ultra graphics processing units.

Shares of Hanmi Semiconductor rose more than 2% in recent trade on Friday.

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