博通發布200G/lane速率的第三代共封裝光學CPO產品

訊石光通訊

2025/05/16

-導讀-博通發布第三代200G/lane CPO產品線，並展示了第二代100G/lane CPO產品及生態系統的成熟性，OSAT工藝、散熱設計、操作流程、光纖佈線和整體良率實現關鍵改進。ICC訊5月15日，博通公司（AVGO）今日宣佈，其共封裝光學（CPO）技術取得重大進展，推出第三代每通道200G（200G/lane）CPO產品線。除200G/lane的突破外，博通還展示了第二代100G/...

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INC","LU0323591593.USD":"SCHRODER ISF QEP GLOBAL QUALITY \"A\" (USD) ACC","LU0354030438.USD":"富国美国大盘成长基金Cl A Acc"},"translate_title":"Broadcom releases third-generation co-packaged optical CPO product with 200G/lane rate","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AVGO":1},"content_text":"-導讀-博通發布第三代200G/lane CPO產品線，並展示了第二代100G/lane CPO產品及生態系統的成熟性，OSAT工藝、散熱設計、操作流程、光纖佈線和整體良率實現關鍵改進。ICC訊5月15日，博通公司（AVGO）今日宣佈，其共封裝光學（CPO）技術取得重大進展，推出第三代每通道200G（200G/lane）CPO產品線。除200G/lane的突破外，博通還展示了第二代100G/lane  CPO產品及生態系統的成熟性，重點強調了OSAT工藝、散熱設計、操作流程、光纖佈線和整體良率的關鍵改進。越來越多的公開行業合作伙伴名單進一步印證了博通CPO平台的成熟度，該平台正為大規模人工智能部署提供橫向擴展（scale-out）和縱向擴展（scale-up）支持。博通的CPO技術傳承博通在CPO領域的領導地位始於2021年推出的第一代Tomahawk  4-Humboldt芯片組。該芯片組推動了整個CPO供應鏈的早期技術學習周期，遠超行業步伐。這一開創性產品引入了高密度集成光引擎、邊緣耦合和可拆卸光纖連接器等關鍵技術。基於此成功，第二代Tomahawk  5-Bailly（TH5-Bailly）芯片組成為業界首款量產CPO解決方案。在TH5-Bailly的生產過程中，博通專注於自動化測試和可擴展製造工藝，為未來代際的大規模量產奠定了基礎。通過部署100G/lane  CPO產品線，博通在CPO系統設計領域積累了無可匹敵的專業經驗，實現了光電組件的無縫集成，在最大化性能的同時提供了行業最低功耗的光互連方案。如今，隨着第三代200G/lane  CPO產品線的發布，以及對第四代400G/lane解決方案的承諾，博通繼續引領行業，提供最低功耗、最高帶寬密度的光互連技術。快速發展的CPO生態系統博通在CPO領域的領導地位不僅源於其尖端交換芯片（ASIC）和光引擎技術，還得益於由無源光組件、互連及系統解決方案合作伙伴構成的完整生態系統。通過100G/lane  CPO產品線，博通已驗證了其技術規模化能力，滿足基於推理的人工智能（AI）的增量需求，並支持下一代AI驅動應用。「博通多年來持續完善CPO平台解決方案，第二代100G/lane產品及生態系統的成熟度便是明證，」博通光系統事業部副總裁兼總經理Near  Margalit博士表示，「憑藉第三代200G/lane  CPO解決方案，我們再次為下一代AI互連技術樹立標杆。我們對行業領先性能、能效和可擴展性的承諾，將助力客户應對快速演進的AI基礎設施需求。」大規模部署的關鍵合作伙伴里程碑博通CPO技術的進步得到了生態系統中眾多公開合作伙伴的支持。本周，多家主要合作方宣佈了重要里程碑：康寧公司宣佈與博通在先進光纖及連接器技術領域展開合作，包括為TH5-Bailly平台提供組件。台達電子宣佈推出採用緊湊3RU規格的TH5-Bailly 51.2T CPO以太網交換機，支持風冷和液冷配置。富士康互連科技（FIT）發布CPO LGA插座及可插拔激光源（PLS）籠和連接器的量產版本，這些是確保高可靠、高性能系統集成的關鍵組件。Micas Networks宣佈量產TH5-Bailly網絡交換系統，與傳統可插拔模塊系統相比，該系統可節省超30%的整機功耗。上海雍邑光電（Twinstar Technologies）慶祝高密度CPO光纖線纜實現里程碑式批量出貨，進一步推動下一代數據中心光互連的擴展。這些合作成果彰顯了CPO生態系統向完整化、集成化邁進的持續進展，為下一代AI網絡解決方案鋪平道路。第三代CPO：開啓200G/lane系統時代博通200G/lane  CPO技術專為下一代高基數縱向擴展（scale-up）和橫向擴展（scale-out）網絡設計，旨在實現與銅互連相當的可靠性和能效。該技術對支持超512節點的縱向擴展集群至關重要，同時可應對下一代基礎模型參數規模擴大帶來的帶寬、功耗和延遲挑戰。第三代解決方案針對縱向擴展互連優化，可解決鏈路抖動和運行中斷等問題——這些因素可能嚴重影響行業實現最低單token成本的能力。博通的第三代及第四代技術路線圖包括與生態夥伴緊密合作，優化CPO解決方案集成，確保其滿足超大規模數據中心和AI工作負載的嚴苛要求。此外，博通堅持開放標準和系統級優化，這對CPO技術的持續成功與演進至關重要。合作伙伴支持聲明康寧光通信高級副總裁兼總經理Mike  O’Day表示：「康寧與博通合作多年，致力於為不斷擴展的AI數據中心提供高性能、高可靠的CPO連接方案。我們提供的解決方案以更低功耗和成本實現了前所未有的光速與帶寬密度。康寧期待繼續與博通合作推進Bailly平台部署，並共同創新下一代200G/lane  CPO系統。」台達數據網絡基礎設施事業部總經理王先生稱：「我們很高興推出這款尖端CPO交換機，助力數據中心實現更高效率與性能。我們的目標是通過創新方案支持下一代網絡基礎設施，為AI網絡提供無與倫比的速度、更低能耗和可擴展性。」富士康互連科技首席技術官Joseph Wang表示：「我們正深化與博通的合作，推動200G  CPO技術創新。雙方共同努力旨在交付可擴展的AI基礎設施，以高性能、高能效的互連技術應對未來數據需求。」Micas Networks首席執行官Joey Gou強調：「博通通過200G/lane  CPO方案突破網絡技術邊界令人振奮。雙方合作推出的首款量產100G/lane  CPO系統已為AI架構提供超低功耗光互連。如今，200G/lane版本將進一步推動高速、高效網絡的發展，賦能下一代應用。我們期待繼續攜手博通，滿足數據驅動世界的演進需求。」","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}