SmartKem Inc. Partners with Manz Asia for Advanced AI Chip Packaging Solutions

Reuters

05-19

SmartKem Inc. Partners with Manz Asia for Advanced AI Chip Packaging Solutions

SmartKem Inc. has announced a new collaboration with Manz Asia, focusing on advancing computer and AI chip packaging solutions. The partnership will feature the demonstration of SmartKem's inkjet printable dielectric layers at SEMICON® SEA 2025 in Singapore. This collaboration leverages Manz Asia's high-precision inkjet printing equipment, which supports a variety of substrates, to create scalable and sustainable semiconductor packaging solutions. The partnership aims to capitalize on the growing demand for advanced packaging in the AI sector, with panel-level packaging poised to significantly enhance throughput and reduce costs. This market is projected to grow to $600 million by 2030.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. SmartKem Inc. published the original content used to generate this news brief via PR Newswire (Ref. ID: LN90290) on May 19, 2025, and is solely responsible for the information contained therein.

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