iPhone 18系列設計關鍵升級：Pro與摺疊機型或搭載全新A20芯片

環球網

2025/06/04

【環球網科技綜合報道】6月4日消息，據外媒報道稱，蘋果分析師Jeff Pu最新預測顯示，iPhone 18 Pro、iPhone 18 Pro Max及傳聞中的摺疊機型iPhone 18 Fold或將搭載全新設計的A20芯片。該消息源自Pu本周與股票研究公司廣發證券（GF Securities）聯合發布的研究報告。報告中指出，A20芯片將在現有A18芯片及即將推出的A19芯片基礎上實現「關鍵設計...

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10:00","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2540494084","market":"us","top_or_hot":-1,"title":"iPhone 18系列設計關鍵升級：Pro與摺疊機型或搭載全新A20芯片","media":"環球網","content":"<div>\n<p>【環球網科技綜合報道】6月4日消息，據外媒報道稱，蘋果分析師Jeff Pu最新預測顯示，iPhone 18 Pro、iPhone 18 Pro Max及傳聞中的摺疊機型iPhone 18 Fold或將搭載全新設計的A20芯片。該消息源自Pu本周與股票研究公司廣發證券（GF Securities）聯合發布的研究報告。報告中指出，A20芯片將在現有A18芯片及即將推出的A19芯片基礎上實現「關鍵設計...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202506041002419770bb0c&s=b\">網頁鏈接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>iPhone 18系列設計關鍵升級：Pro與摺疊機型或搭載全新A20芯片</title>\n<style 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href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202506041002419770bb0c&s=b\">網頁鏈接</a>\n\n</div>\n\n<div class=\"bt-text\">\n\n\n<p> 來源：<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202506041002419770bb0c&s=b\">環球網</a></p>\n<p>為提升您的閱讀體驗，我們對本頁面進行了排版優化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU2458330169.SGD","symbol_name":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202506041002419770bb0c&s=b","article_id":"2540494084","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202506041002419770bb0c&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description 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design upgrades of iPhone 18 series: Pro and folding models may be equipped with new A20 chip","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AAPL":1,"MACW.SI":0.6},"content_text":"【環球網科技綜合報道】6月4日消息，據外媒報道稱，蘋果分析師Jeff Pu最新預測顯示，iPhone 18 Pro、iPhone 18 Pro Max及傳聞中的摺疊機型iPhone 18 Fold或將搭載全新設計的A20芯片。該消息源自Pu本周與股票研究公司廣發證券（GF Securities）聯合發布的研究報告。報告中指出，A20芯片將在現有A18芯片及即將推出的A19芯片基礎上實現「關鍵設計改進」，但具體技術細節尚未披露。這一預測引發市場對蘋果下一代芯片性能與架構創新的關注。目前，iPhone 16 Pro 機型搭載的 A18 Pro 芯片採用台積電第二代 3nm 工藝製造，而即將推出的 iPhone 17 Pro 機型預計搭載的 A19 Pro 芯片將採用台積電第三代 3nm 工藝。據分析師稱，從 iPhone 18 Pro 及傳聞中的摺疊機型 iPhone 18 Fold 開始，蘋果芯片將正式從 3nm 工藝轉向更先進的 2nm 工藝。工藝升級後，每個芯片可容納的晶體管數量將顯著增加，為性能提升奠定基礎。具體而言，此前行業報道顯示，A20 芯片在速度上將較 A19 芯片提升 15%，同時能效優化幅度達 30%。（青山）","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}