蘋果A20芯片首發2nm工藝 iPhone 18 Pro和摺疊屏獨佔

手機中國

2025/06/16

【CNMO科技消息】據中國台灣《工商時報》報道，台積電已開始接受2nm晶圓訂單，但首批採用該先進製程的芯片預計要到2025年底纔會亮相。傳聞稱，蘋果如往常一樣搶先鎖定該新技術，其下一代旗艦芯片A20將採用台積電2nm工藝，並率先導入WMCM（晶圓級多芯片模塊）封裝技術，帶來性能與能效的雙重躍升。據悉，iPhone 18 Pro、iPhone 18 Pro Max以及傳聞中的iPhone 18 ...

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{"basename":"/hant","ssrTDKData":{"titleTemplate":"%s - 老虎證券","title":"老虎证券全球投资理财平台| 一站式投资美股新股港股A股","description":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","keywords":"老虎證券,老虎證券開戶,老虎券商,老虎證券官網,老虎證券app,tigertrade老虎證券,股票,炒股,新加坡股票交易平臺,投資,投資理財","social":{"ogDescription":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.be62fbe1.png","ogUrl":"https://www.itiger.com/hant/news/2543623928"},"companyName":"老虎證券"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"SGP","license":"TBSG","edition":"fundamental"},"isCrawlerRequest":true,"__swrFallback__":{"@#url:\"https://stock-news.skytigris.cn/v3/news\",params:#id:\"2543623928\",edition:\"fundamental\",auth_exemption:1,,,undefined,":{"share":"https://ttm.financial/m/news/2543623928?lang=zh_TW&edition=fundamental","thumbnail":"","is_english":false,"pubTime":"2025-06-16 14:58","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2543623928","market":"us","top_or_hot":-1,"title":"蘋果A20芯片首發2nm工藝 iPhone 18 Pro和摺疊屏獨佔","media":"手機中國","content":"<div>\n<p>【CNMO科技消息】據中國台灣《工商時報》報道，台積電已開始接受2nm晶圓訂單，但首批採用該先進製程的芯片預計要到2025年底纔會亮相。傳聞稱，蘋果如往常一樣搶先鎖定該新技術，其下一代旗艦芯片A20將採用台積電2nm工藝，並率先導入WMCM（晶圓級多芯片模塊）封裝技術，帶來性能與能效的雙重躍升。據悉，iPhone 18 Pro、iPhone 18 Pro Max以及傳聞中的iPhone 18 ...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025061615011897817d4d&s=b\">網頁鏈接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>蘋果A20芯片首發2nm工藝 iPhone 18 Pro和摺疊屏獨佔</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n蘋果A20芯片首發2nm工藝 iPhone 18 Pro和摺疊屏獨佔\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">手機中國</strong><span class=\"h-time small\">2025-06-16 14:58</span>\n</p>\n</h4>\n</header>\n<article>\n<div>\n<p>【CNMO科技消息】據中國台灣《工商時報》報道，台積電已開始接受2nm晶圓訂單，但首批採用該先進製程的芯片預計要到2025年底纔會亮相。傳聞稱，蘋果如往常一樣搶先鎖定該新技術，其下一代旗艦芯片A20將採用台積電2nm工藝，並率先導入WMCM（晶圓級多芯片模塊）封裝技術，帶來性能與能效的雙重躍升。據悉，iPhone 18 Pro、iPhone 18 Pro Max以及傳聞中的iPhone 18 ...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025061615011897817d4d&s=b\">網頁鏈接</a>\n\n</div>\n\n<div class=\"bt-text\">\n\n\n<p> 來源：<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025061615011897817d4d&s=b\">手機中國</a></p>\n<p>為提升您的閱讀體驗，我們對本頁面進行了排版優化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"SG9999014542.SGD","symbol_name":"United Income Focus Trust Acc SGD","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025061615011897817d4d&s=b","article_id":"2543623928","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025061615011897817d4d&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2543623928","pubTimestamp":1750057080,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"傳聞稱，蘋果如往常一樣搶先鎖定該新技術，其下一代旗艦芯片A20將採用台積電2nm工藝，並率先導入WMCM封裝技術，帶來性能與能效的雙重躍升。據悉，iPhone 18 Pro、iPhone 18 Pro Max以及傳聞中的iPhone 18 Fold摺疊機將成為A20芯片與WMCM封裝的首發機型。值得注意的是，目前消息並未提及iPhone 18與iPhone 18 Plus等非Pro機型是否也會採用WMCM封裝。考慮到成本控制與產品定位，蘋果或許會繼續在標準款上使用舊版InFo封裝，以拉開與Pro系列的差異。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"SG9999014542.SGD":"United Income Focus Trust Acc SGD","LU0353189763.USD":"ALLSPRING  US ALL CAP GROWTH FUND \"I\" (USD) ACC","SG9999014906.USD":"大华全球优质成长基金Acc USD","LU1868836757.USD":"CT (LUX) I AMERICAN FUND \"2\" (USD) ACC","BK4585":"ETF&股票定投概念","LU2471134523.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) ACC","LU0345769128.USD":"NINETY ONE GSF GLOBAL EQUITY \"A\" (USD) ACC","LU0861579265.USD":"联博低波幅策略股票基金A","IE00BKDWB100.SGD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A5H\" (SGDHDG) ACC","LU0868494617.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD) ACC","IE00BSNM7G36.USD":"NEUBERGER BERMAN SYSTEMATIC GLOBAL SUSTAINABLE VALUE \"A\" (USD) ACC","BK4575":"芯片概念","IE000YTNTUN2.SGD":"PIMCO BALANCED INCOME AND GROWTH \"M\" (SGDHDG)INC","LU2750360641.GBP":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (GBPHDG) INC","LU2108987350.USD":"UBS (LUX) EQUITY SICAV GLOBAL OPPORTUNITY SUSTAINABLE (USD) \"P\" (USD) ACC","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","LU0823434740.USD":"BNP PARIBAS US GROWTH \"C\" (USD) INC","SG9999015945.SGD":"LionGlobal Disruptive Innovation Fund A SGD","AAPL":"苹果","BK4515":"5G概念","LU1642822529.SGD":"THREADNEEDLE (LUX) GLOBAL TECHNOLOGY \"A\" (SGD) ACC","IE00BWXC8680.SGD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A5\" (SGD) ACC","LU0077335932.USD":"FIDELITY AMERICAN GROWTH \"A\" INC","BK4579":"人工智能","LU1989772923.USD":"CPR Invest - Climate Action A2 Acc USD-H","MACW.SI":"APPLE 3xLongSG261006","LU2237443465.HKD":"abrdn SICAV I -  GLOBAL DYNAMIC DIVIDEND \"A\" (HKD) INC","LU1934455277.USD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"AD\" (USD) INC","IE00BK4W5L77.USD":"HSBC GLOBAL FUNDS ICAV US EQUITY INDEX \"HC\" (USD) ACC","LU2505996681.GBP":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4H\" (GBPHDG) INC","LU1127390331.HKD":"AB SICAV I - ALL MARKET INCOME PORTFOLIO \"A\" (HKD) ACC","LU1582986359.USD":"M&G (LUX) INCOME ALLOCATION \"A-H\" (USDHDG) ACC","LU2023250504.SGD":"Allianz Thematica Cl AMg DIS H2-SGD","LU0672654240.SGD":"FTIF - Franklin US Opportunities A Acc SGD-H1","TSM":"台积电","LU0323591593.USD":"SCHRODER ISF QEP GLOBAL QUALITY \"A\" (USD) ACC","LU2505996509.AUD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4H\" (AUDHDG) INC","LU0061475181.USD":"THREADNEEDLE (LUX) AMERICAN \"AU\" (USD) ACC","LU0234570918.USD":"高盛全球核心股票组合Acc Close","LU1003077747.HKD":"BGF GLOBAL EQUITY INCOME \"A6\" (HKDHDG) INC","LU1267930730.SGD":"富兰克林美国机遇基金AS Acc SGD (CPF)","LU1868837136.USD":"CT (LUX) I AMERICAN \"8\" (USD) ACC","LU1244550221.USD":"FRANKLIN GLOBAL MULTI-ASSET  INCOME \"A\" (USDHEDGED) INC (M)","LU1116320737.USD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A6\" (USD) INC","IE00B4YYXB79.USD":"PIMCO BALANCED INCOME AND GROWTH \"E\" (USD) ACC","IE00BJJMRX11.SGD":"Janus Henderson Balanced A Acc SGD","LU1868836591.USD":"CT (LUX) I AMERICAN \"1U\"(USD) ACC","IE00B3SWFQ91.USD":"PIMCO BALANCED INCOME AND GROWTH \"E\" (USD) INC","LU2471134952.CNY":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (CNYHDG) INC","BK4553":"喜马拉雅资本持仓"},"translate_title":"Apple A20 chip debuts with 2nm process exclusive to iPhone 18 Pro and folding screen","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"MACW.SI":0.6,"TSM":0.9,"AAPL":1},"content_text":"【CNMO科技消息】據中國台灣《工商時報》報道，台積電已開始接受2nm晶圓訂單，但首批採用該先進製程的芯片預計要到2025年底才會亮相。傳聞稱，蘋果如往常一樣搶先鎖定該新技術，其下一代旗艦芯片A20將採用台積電2nm工藝，並率先導入WMCM（晶圓級多芯片模塊）封裝技術，帶來性能與能效的雙重躍升。據悉，iPhone 18 Pro、iPhone 18 Pro Max以及傳聞中的iPhone 18 Fold摺疊機將成為A20芯片與WMCM封裝的首發機型。WMCM技術的優勢在於，它能在晶圓階段整合多個核心組件，如CPU、GPU、內存控制器等，然後再切割成一顆顆芯片。相比傳統的InFo（扇出型封裝）技術，WMCM更具靈活性與集成度，有助於蘋果在保持芯片尺寸不變的同時實現更高的能效比與算力密度，尤其適用於高端旗艦機型。傳聞還指出，A20芯片在相同功耗下將比A19快15%，繼續強化蘋果芯片在性能與能耗控制上的領先優勢。不過，在內存方面，蘋果似乎仍將維持12GB RAM的配置，暫未進一步提升。值得注意的是，目前消息並未提及iPhone 18與iPhone 18 Plus等非Pro機型是否也會採用WMCM封裝。考慮到成本控制與產品定位，蘋果或許會繼續在標準款上使用舊版InFo封裝，以拉開與Pro系列的差異。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"2","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}