Applied Materials Inc. has announced an expansion of its partnership with CEA-Leti to drive innovation in specialty semiconductors. Through their joint lab based in Grenoble, France, the collaboration aims to develop materials engineering solutions to enhance energy efficiency in AI data centers. Under a memorandum of understanding, the initiative focuses on leveraging their combined expertise to accelerate innovation and commercialization of next-generation specialty chips. The upgraded lab will feature state-of-the-art equipment and advanced packaging tools, fostering breakthroughs in semiconductor technologies and contributing to the chipmaking ecosystem in France.
Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Applied Materials Inc. published the original content used to generate this news brief via GlobeNewswire (Ref. ID: GNW9469068-en) on June 16, 2025, and is solely responsible for the information contained therein.