BRIEF-中國電機驅動芯片設計公司峯岹科技擬在香港H股上市籌高至19.6億港元

路透中文

06/30

BRIEF-中國電機驅動芯片設計公司<a href="https://laohu8.com/S/688279">峯岹科技</a>擬在香港H股上市籌高至19.6億港元

路透香港6月30日 - 峯岹科技688279.SS1304.HK：

* 香港全球發售1,629.95萬股H股，最高發售價每股120.5港元；預期7月9日H股開始在聯交所買賣

* 基石投資者同意認購總額為1.12億美元的發售股份；基石投資者包括泰康人壽、保銀、華夏基金、三花智控2050.HK002050.SZ旗下三花國際新加坡等等

* 我們是一家芯片設計公司，專注於BLDC電機驅動控制芯片的設計與研發；BLDC電機是一種採用電子換向方式驅動的無刷電機

欲覽詳情，請點擊此處

(Reporting By Alison Lui)

((alison.lui@thomsonreuters.com; +852 3462 7749;))

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