消息稱聯電先進封裝中介層獲得高通驗證，接近量產出貨

IT之家

2025/07/08

IT之家 7 月 8 日消息，台媒《經濟日報》昨日報道稱，聯華電子（IT之家注：即聯電、UMC）的先進封裝中介層 (Interposer) 獲得高通驗證，進入試產階段，有望 2026 年首季度量產出貨。▲ 聯電官網對中介層介紹報道指出，聯電的先進封裝中介層業務此前侷限在 RFSOI 製程應用領域，對營收貢獻有限；而與高通的合作則將業務擴展到高速計算芯片方面，包括 AI PC、車載芯片和 AI ...

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shipment","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"UMC":1,"QCOM":1},"content_text":"IT之家 7 月 8 日消息，台媒《經濟日報》昨日報道稱，聯華電子（IT之家注：即聯電、UMC）的先進封裝中介層 (Interposer) 獲得高通驗證，進入試產階段，有望 2026 年首季度量產出貨。▲ 聯電官網對中介層介紹報道指出，聯電的先進封裝中介層業務此前侷限在 RFSOI 製程應用領域，對營收貢獻有限；而與高通的合作則將業務擴展到高速計算芯片方面，包括 AI PC、車載芯片和 AI 服務器領域，極大擴展了潛在市場規模。此次聯電向高通出樣的中介層兼具電容功能，規格為 1500 nF / mm2，與邏輯芯片和內存的需求匹配。廣告聲明：文內含有的對外跳轉鏈接（包括不限於超鏈接、二維碼、口令等形式），用於傳遞更多信息，節省甄選時間，結果僅供參考，IT之家所有文章均包含本聲明。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}