One UI 8固件代碼顯示三星首款三摺疊手機配高通驍龍 8至尊版芯片

市場資訊

07-18

　　炒股就看金麒麟分析師研報，權威，專業，及時，全面，助您挖掘潛力主題機會！

（來源：IT之家）

IT之家 7 月 18 日消息，科技媒體 Android Authority 昨日（7 月 17 日）發佈博文，通過挖掘 One UI 8 固件更新，發現三星首款三摺疊手機將配備高通驍龍 8 至尊版芯片。

該媒體挖掘 One UI 8 固件更新，發現了“siop_q7mq_sm8750”的蹤跡，其中“q7mq”是三星首款三摺疊手機的內部開發代號，而“sm8750”對應的是高通驍龍 8 至尊版芯片。

根據最新曝料信息，三星首款三摺疊手機在上市後，可能會叫做“Galaxy Z TriFold”，三星已經於 7 月 15 日獲批了相關商標。

消息源認爲三星三折屏手機內屏預估爲 10 英寸，影像方面會採用 Galaxy Z Fold7 類似配置，售價可能高達 400 萬韓元（IT之家注：現匯率約合 20644 元人民幣），初期僅在中國和韓國市場銷售。

海量資訊、精準解讀，盡在新浪財經APP

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日）發佈博文，通過挖掘 One UI 8 固件更新，<font cms-style=\"font-L strong-Bold\">發現<a href=\"https://laohu8.com/S/SMSN.UK\">三星</a>首款三摺疊手機將配備<a href=\"https://laohu8.com/S/QCOM\">高通</a>驍龍 8 至尊版芯片。</font></p><p cms-style=\"font-L\">該媒體挖掘 One UI 8 固件更新，發現了“siop_q7mq_sm8750”的蹤跡，其中“q7mq”是三星首款三摺疊手機的內部開發代號，而“sm8750”對應的是高通驍龍 8 至尊版芯片。</p><div><img src=\"http://n.sinaimg.cn/spider20250718/232/w660h372/20250718/8ac7-0a8ea0cc766b44730ec22af41faa8796.jpg\"/><span></span></div><p cms-style=\"font-L\">根據最新曝料信息，三星首款三摺疊手機在上市後，可能會叫做“Galaxy Z TriFold”，三星已經於 7 月 15 日獲批了相關商標。</p><div><img src=\"http://n.sinaimg.cn/spider20250718/765/w660h105/20250718/9a29-92f08328ad9690a9f78c2a29b93c6ac2.jpg\"/><span></span></div><div><img src=\"http://n.sinaimg.cn/spider20250718/544/w660h684/20250718/65a6-a5867586c9452750b40545056d4c6290.jpg\"/><span></span></div><p cms-style=\"font-L\">消息源認爲三星三折屏手機內屏預估爲 10 英寸，影像方面會採用 Galaxy Z Fold7 類似配置，售價可能高達 400 萬韓元（IT之家注：現匯率約合 20644 元人民幣），初期僅在中國和韓國市場銷售。</p><div><img 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