Taiwan Semiconductor Manufacturing (TSM) is accelerating the volume production of its fabrication facilities in the US "by several quarters" due to strong interest from its "leading US customers," Chairman and Chief Executive C.C. Wei said in an earnings conference on Thursday, according to a FactSet transcript.

The chipmaker began high-volume production at its first fabrication facility in Arizona in late 2024 and has completed the construction of a second one, while the construction of its third facility has already begun, Wei said.

For its third facility, "we will look into speeding up the production schedule as well based on the strong AI-related demand from our customers," Wei said.

The company also plans to build new advanced packaging facilities and establish a research and development center in the state to "complete [the] AI supply chain," the CEO said.

"After completion, around 30% of our 2-nanometer and more advanced capacity will be located in Arizona, creating an independent leading-edge semiconductor manufacturing cluster in the US," Wei said.

Shares of the company were up 3.2% in recent trading.

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