全球首發：小米REDMI Note 15 Pro +手機搭載第四代驍龍7s處理器

市場資訊

08/20

　　炒股就看金麒麟分析師研報，權威，專業，及時，全面，助您挖掘潛力主題機會！

（來源：IT之家）

IT之家 8 月 20 日消息，小米 REDMI Note 15 Pro 系列手機將於 8 月 21 日 19:00 發佈，具備“真抗摔”及“真防水”屬性，並在屏幕、續航、通信諸多方面實現“旗艦體驗”，官方今日宣佈 REDMI Note 15 Pro + 將全球首發第四代驍龍 7s 處理器。

官方還稱，新機還將搭載 Note 小金剛首個冰封循環冷泵，擁有 5200mm² 超大面積，3 倍導熱能力，高頻應用不卡頓，日常使用超流暢。

IT之家此前報道，高通第四代驍龍 7s 移動平臺採用 4 納米工藝製程，CPU 的性能提升了 7%、GPU 圖形渲染速度提升 7%，搭載低功耗人工智能系統，支持設備端生成式人工智能。第四代驍龍 7s 移動平臺擁有旗艦同款 8 核設計，新平臺還支持 Wi-Fi 4 / Wi-Fi 5 / Wi-Fi 6 / Wi-Fi 6E、5G+5G 和 5G+4G 雙卡、藍牙 5.4 等。

海量資訊、精準解讀，盡在新浪財經APP

免責聲明：投資有風險，本文並非投資建議，以上內容不應被視為任何金融產品的購買或出售要約、建議或邀請，作者或其他用戶的任何相關討論、評論或帖子也不應被視為此類內容。本文僅供一般參考，不考慮您的個人投資目標、財務狀況或需求。TTM對信息的準確性和完整性不承擔任何責任或保證，投資者應自行研究並在投資前尋求專業建議。

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19:00 發佈，具備“真抗摔”及“真防水”屬性，並在屏幕、續航、通信諸多方面實現“旗艦體驗”，官方今日宣佈 REDMI Note 15 Pro + 將全球首發第四代驍龍 7s 處理器。</p><p cms-style=\"font-L\">官方還稱，新機還將搭載 Note 小金剛首個冰封循環冷泵，擁有 5200mm² 超大面積，3 倍導熱能力，高頻應用不卡頓，日常使用超流暢。</p><div><img src=\"http://n.sinaimg.cn/spider20250820/740/w660h880/20250820/bb94-3513d3f02db0e0d1b49a102998640697.jpg\"/><span></span></div><p cms-style=\"font-L\">IT之家此前報道，<a href=\"https://laohu8.com/S/QCOM\">高通</a>第四代驍龍 7s 移動平臺採用 4 納米工藝製程，CPU 的性能提升了 7%、GPU 圖形渲染速度提升 7%，搭載低功耗人工智能系統，支持設備端生成式人工智能。第四代驍龍 7s 移動平臺擁有旗艦同款 8 核設計，新平臺還支持 Wi-Fi 4 / Wi-Fi 5 / Wi-Fi 6 / Wi-Fi 6E、5G+5G 和 5G+4G 雙卡、藍牙 5.4 等。</p>\n<div>\n<div><img src=\"\"/></div>\n<div>海量資訊、精準解讀，盡在新浪財經APP</div>\n</div>\n</div></body></html>\n<div class=\"bt-text\">\n\n\n<p> 來源：<a 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