Lam Research Corporation has announced a strategic partnership with JSR Corporation and its subsidiary, Inpria Corporation, to advance semiconductor manufacturing technologies. The collaboration focuses on next-generation patterning, including dry resist technology for extreme ultraviolet (EUV) lithography, and the development of advanced materials for atomic layer etching and deposition processes. This non-exclusive cross-licensing agreement aims to integrate JSR/Inpria's patterning resists and films with Lam's etch and dry resist deposition technologies. The partnership will also explore innovation in metal oxide resists, high NA EUV patterning, and advanced films to support chipmakers in the AI era. Additionally, leveraging JSR's acquisition of Yamanaka Hutech Corporation, the companies plan to investigate new precursor materials and processes for enhanced atomic layer deposition and etching solutions.