隨着人工智能和先進封裝推動需求，半導體代工市場將增長

電子產品世界

2025/10/10

根據 Credence Research 的一份新報告，全球代工行業正處於穩定增長的軌道上，預計將從 2023 年的 1255.6 億美元增長到 2032 年的 1717.0 億美元。該公司表示，3.99% 的複合年增長率（CAGR）凸顯了汽車、航空航天和工業機械等關鍵行業對精密金屬鑄造和半導體制造的需求不斷增長。對於 eeNews Europe 讀者來說，這一趨勢標誌着半導體制造、封裝和...

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讀者來説，這一趨勢標誌着半導體制造、封裝和本地化芯片生產的關鍵發展。所有這些都是塑造歐洲及其他地區電子供應鏈和創新格局的關鍵領域。AI、高級節點和地理轉移人工智能（AI）、高性能計算 （HPC） 和下一代通信技術的快速採用推動了代工市場的擴張。正如我們所報道的，對人工智能加速器、GPU 和 5G 芯片組的需求正在推動代工廠提高產能並遷移到 3 納米和 2 納米等先進工藝節點。與此同時，代工廠正在大力投資異構集成和基於小芯片的架構，以提高人工智能工作負載的效率和靈活性。先進的封裝技術——包括 3D 堆疊和 CoWoS 和 InFO 等晶圓級集成方法——也越來越受到關注，從而實現更密集、更節能的芯片設計。各國政府在重塑全球鑄造格局方面發揮着重要作用。美國、中國和歐盟成員國正在提供大規模補貼，以實現半導體制造的本地化，減少對海外晶圓廠的依賴。歐洲自己的《芯片法案》旨在通過支持德國、法國和意大利的項目來加強這一戰略，特別是在汽車級半導體和工業物聯網應用方面。競爭和新興機遇Credence Research 指出，由台積電、三星和格芯等主要參與者主導的競爭格局適度整合。小型代工廠繼續在成熟節點和汽車和工業電子等專業市場取得成功。報告強調，成功整合數字化和可持續發展實踐的代工廠可能會獲得競爭優勢。自動化和數字鑄造技術（包括人工智能驅動的質量控制、3D 砂打印和預測性維護）正在提高產量和能源效率，同時減少浪費。隨着能源成本的上升和法規的收緊，可持續發展已成為戰略重點。展望未來，高性能計算、邊緣人工智能和數據中心應用應該會有很多機會。符合區域激勵措施並投資先進材料和數字製造的代工廠可以很好地抓住未來的增長。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}