瑞銀報告：英偉達 2026 年 CoWoS 晶圓需求按年漲 40% 台積電產能難滿足

市場資訊

2025/10/11

炒股就看金麒麟分析師研報，權威，專業，及時，全面，助您挖掘潛力主題機會！（來源：環球網資訊）來源：環球網【環球網科技綜合報道】10月11日消息，瑞銀集團（UBS）近日發布最新分析師報告，對英偉達未來先進封裝需求及產能格局作出重要預測。報告顯示，受當前 Blackwell 系列芯片熱銷與下一代 Rubin AI 芯片訂單拉動，英偉達 2026 年對 CoWoS（芯片晶圓級系統集成）先進封裝的需求將...

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已啓動量產爬坡，成為拉動需求的關鍵新動力。值得關注的是，英偉達新推出的 Rubin CPX 平台進一步加劇了這一需求態勢 —— 該平台專注於 AI 推理任務，其獨特芯片結構需依賴 CoWoS-L 封裝技術，隨着企業客户對推理專用硬件的興趣持續升温，Rubin CPX 將成為台積電先進封裝產能的重要消耗來源。CoWoS 作為高端 AI 芯片製造的關鍵環節，其產能供給直接關係到全球 AI 產業發展節奏。當前，在人工智能技術加速滲透、行業需求持續擴張的背景下，不僅英偉達等芯片企業對先進封裝的需求呈爆發式增長，整個半導體產業鏈對高端製造產能的依賴度也不斷提升。然而，報告指出，台積電作為全球 CoWoS 產能的主要供給方，目前已面臨顯著的產能壓力，難以完全滿足科技巨頭的半導體及封裝訂單需求，供需矛盾成為當前產業鏈面臨的重要挑戰。（純鈞）","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"dataReport","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}