AMD 首次公開靜態展示下代機架級 AI 系統「Helios」，預計 2026 年批量部署

IT之家

10/15

IT之家 10 月 15 日消息，AMD 在美國加州舉行的 2025 OCP 全球峯會上首次公開靜態展示了其首個專為前沿 AI 工作負載設計的機架系統參考設計 "Helios"。"Helios" 系統採用 Meta 在本次會議上推出的 ORW「雙寬」機架規範，這一形態針對下一代 AI 系統的電源、冷卻和可維護性需求進行了優化。標準化加速了 "Helios" 系統的上市、部署、投運，也支持 OEM ...

網頁鏈接

免責聲明：投資有風險，本文並非投資建議，以上內容不應被視為任何金融產品的購買或出售要約、建議或邀請，作者或其他用戶的任何相關討論、評論或帖子也不應被視為此類內容。本文僅供一般參考，不考慮您的個人投資目標、財務狀況或需求。TTM對信息的準確性和完整性不承擔任何責任或保證，投資者應自行研究並在投資前尋求專業建議。

熱議股票

{"basename":"/hant","ssrTDKData":{"titleTemplate":"%s - 老虎證券","title":"老虎证券全球投资理财平台| 一站式投资美股新股港股A股","description":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","keywords":"老虎證券,老虎證券開戶,老虎券商,老虎證券官網,老虎證券app,tigertrade老虎證券,股票,炒股,新加坡股票交易平臺,投資,投資理財","social":{"ogDescription":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.be62fbe1.png","ogUrl":"https://www.itiger.com/hant/news/2575322725"},"companyName":"老虎證券"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"SGP","license":"TBSG","edition":"fundamental"},"isCrawlerRequest":true,"__swrFallback__":{"@#url:\"https://stock-news.skytigris.cn/v3/news\",params:#id:\"2575322725\",edition:\"fundamental\",auth_exemption:1,,,undefined,":{"share":"https://ttm.financial/m/news/2575322725?lang=zh_TW&edition=fundamental","thumbnail":"","is_english":false,"pubTime":"2025-10-15 09:36","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2575322725","market":"us","top_or_hot":-1,"title":"AMD 首次公開靜態展示下代機架級 AI 系統「Helios」，預計 2026 年批量部署","media":"IT之家","content":"<div>\n<p>IT之家 10 月 15 日消息，AMD 在美國加州舉行的 2025 OCP 全球峯會上首次公開靜態展示了其首個專為前沿 AI 工作負載設計的機架系統參考設計 \"Helios\"。\"Helios\" 系統採用 Meta 在本次會議上推出的 ORW「雙寬」機架規範，這一形態針對下一代 AI 系統的電源、冷卻和可維護性需求進行了優化。標準化加速了 \"Helios\" 系統的上市、部署、投運，也支持 OEM ...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251015093638a46077d6&s=b\">網頁鏈接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>AMD 首次公開靜態展示下代機架級 AI 系統「Helios」，預計 2026 年批量部署</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nAMD 首次公開靜態展示下代機架級 AI 系統「Helios」，預計 2026 年批量部署\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">IT之家</strong><span class=\"h-time small\">2025-10-15 09:36</span>\n</p>\n</h4>\n</header>\n<article>\n<div>\n<p>IT之家 10 月 15 日消息，AMD 在美國加州舉行的 2025 OCP 全球峯會上首次公開靜態展示了其首個專為前沿 AI 工作負載設計的機架系統參考設計 \"Helios\"。\"Helios\" 系統採用 Meta 在本次會議上推出的 ORW「雙寬」機架規範，這一形態針對下一代 AI 系統的電源、冷卻和可維護性需求進行了優化。標準化加速了 \"Helios\" 系統的上市、部署、投運，也支持 OEM ...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251015093638a46077d6&s=b\">網頁鏈接</a>\n\n</div>\n\n<div class=\"bt-text\">\n\n\n<p> 來源：<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251015093638a46077d6&s=b\">IT之家</a></p>\n<p>為提升您的閱讀體驗，我們對本頁面進行了排版優化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0109392836.USD","symbol_name":"富蘭克林科技股A","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251015093638a46077d6&s=b","article_id":"2575322725","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251015093638a46077d6&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2575322725","pubTimestamp":1760492173,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"IT之家 10 月 15 日消息，AMD 在美國加州舉行的 2025 OCP 全球峯會上首次公開靜態展示了其首個專為前沿 AI 工作負載設計的機架系統參考設計 \"Helios\"。\"Helios\" 系統採用 Meta 在本次會議上推出的 ORW「雙寬」機架規範，這一形態針對下一代 AI 系統的電源、冷卻和可維護性需求進行了優化。AMD \"Helios\" 機架系統包含 72 個 Instinct MI450 系列顯卡加速器，擁有共計 2.9 exaFLOPS 的 FP4 性能，總 HBM 內存容量達到 31 TB。\"Helios\" 目前作為參考設計向 OEM 和 ODM 合作伙伴發佈，預計將於 2026 年實現批量部署。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU0109392836.USD":"富兰克林科技股A","LU1988902786.USD":"FULLERTON LUX FUNDS GLOBAL ABSOLUTE ALPHA \"I\" (USD) ACC","LU1951200564.SGD":"Natixis Thematics AI & Robotics Fund R/A SGD","BK4554":"元宇宙及AR概念","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","LU1242518931.SGD":"Fullerton Lux Funds - Asia Absolute Alpha A Acc SGD","BK4532":"文艺复兴科技持仓","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","BK4543":"AI","BK4512":"苹果概念","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","LU1923623000.USD":"Natixis Thematics AI & Robotics Fund R/A USD","LU0979878070.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"A\" (USD) ACC","IE00BMPRXR70.SGD":"Neuberger Berman 5G Connectivity A Acc SGD-H","BK4141":"半导体产品","BK4534":"瑞士信贷持仓","IE00BMPRXN33.USD":"NEUBERGER BERMAN 5G CONNECTIVITY \"A\" (USD) ACC","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","BK4529":"IDC概念","BK4575":"芯片概念","BK4566":"资本集团","LU1861559042.SGD":"日兴方舟颠覆性创新基金B SGD","LU2264538146.SGD":"Fullerton Lux Funds - Global Absolute Alpha A Acc SGD","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","LU0198837287.USD":"UBS (LUX) EQUITY SICAV - USA GROWTH \"P\" (USD) ACC","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","BK4612":"AI芯片","LU0056508442.USD":"贝莱德世界科技基金A2","LU0390134368.USD":"FRANKLIN GLOBAL GROWTH \"A\" (USD) ACC","LU0823421333.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) ACC","LU2054465674.USD":"UBS (LUX) KEY SELEC SICAV DIGITAL TRANSFORMATION T \"P\" (USD) ACC","LU1303367103.USD":"摩根大通多经理另类基金 A (acc)","BK4614":"Manus概念股","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","LU1242518857.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"I\" (USD) ACC","GFS":"GLOBALFOUNDRIES Inc.","BK4588":"碎股","LU2098885051.SGD":"JPMorgan Funds - Multi-Manager Alternatives A (acc) SGD","BK4605":"半导体精选","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU0127658192.USD":"EASTSPRING INVESTMENTS GLOBAL TECHNOLOGY \"A\" (USD) ACC","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU1880398554.USD":"AMUNDI FUNDS GLOBAL EQUITY \"A2\" (USD) INC","AMD":"美国超微公司","LU0823434583.USD":"BNP PARIBAS US GROWTH \"C\" (USD) ACC","LU2250418816.HKD":"BGF WORLD TECHNOLOGY \"A\" (HKD) ACC","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","LU1951198990.SGD":"Natixis Thematics AI & Robotics Fund H-R/A SGD-H","BK4573":"虚拟现实"},"translate_title":"AMD publicly statically demonstrates the next-generation rack-level AI system \"Helios\" for the first time, which is expected to be deployed in batches in 2026","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AMD":1.5,"GFS":1.5},"content_text":"IT之家 10 月 15 日消息，AMD 在美國加州舉行的 2025 OCP 全球峯會上首次公開靜態展示了其首個專為前沿 AI 工作負載設計的機架系統參考設計 \"Helios\"。\"Helios\" 系統採用 Meta 在本次會議上推出的 ORW「雙寬」機架規範，這一形態針對下一代 AI 系統的電源、冷卻和可維護性需求進行了優化。標準化加速了 \"Helios\" 系統的上市、部署、投運，也支持 OEM / ODM 在基礎設計上進行差異化的定製。AMD \"Helios\" 機架系統包含 72 個 Instinct MI450 系列顯卡加速器，擁有共計 2.9 exaFLOPS 的 FP4 性能，總 HBM 內存容量達到 31 TB。此外其還具有 260 TB/s 的 UALoE 縱向擴展帶寬和 43 TB/s 的 UEC 橫向擴展帶寬，有助於確保跨 GPU、節點和機架的無縫通信。\"Helios\" 目前作為參考設計向 OEM 和 ODM 合作伙伴發佈，預計將於 2026 年實現批量部署。廣告聲明：文內含有的對外跳轉鏈接（包括不限於超鏈接、二維碼、口令等形式），用於傳遞更多信息，節省甄選時間，結果僅供參考，IT之家所有文章均包含本聲明。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}