蘋果芯片，製程落後？

半導體芯聞

2025/10/15

如果您希望可以時常見面，歡迎標星收藏哦~來源：內容編譯自tweaktown。據報道，蘋果公司預計將在本周發布下一代 M5 處理器，並同時帶來其他新品消息。消息稱，全新的 M5 芯片將採用台積電 3nm「N3E」工藝節點製造。根據《工商時報》的最新報道，我們也得知了更多關於蘋果自研芯片路線的細節：預計下一代的 M6 處理器將在 2026 年亮相，並有望成為蘋果首批基於2nm 製程的筆電芯片，邁向...

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芯片最終會採用哪一種台積電製程。參考鏈接https://www.tweaktown.com/news/108259/apples-next-gen-m5-processor-rumored-for-announcement-this-week-fabbed-on-tsmc-n3e-process/index.html點這裏 加關注，鎖定更多原創內容","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}