蘋果自研 5G 芯片 C2 曝光：iPhone 18 全系搭載、支持 mmWave 毫米波，沿用臺積電 N4 工藝

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IT之家 10 月 29 日消息，工商時報昨日（10 月 28 日）發佈博文，報道稱蘋果計劃在其首款摺疊手機、2026 年推出的 iPhone 18 系列上，全面換用其自研的第二代 5G 基帶芯片 C2，不過會繼續採用臺積電 4 納米（N4）工藝量產。消息稱蘋果在發佈 iPhone 16e 後不久，便着手研發 C2 芯片，目標是在 iPhone 18 上徹底實現基帶芯片的自給自足。這也意味着 ...

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equipped with and support mmWave millimeter wave, using TSMC's N4 process","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AAPL":1.5,"TSM":1.5,"MACW.SI":0.6,"03145":0.6},"content_text":"IT之家 10 月 29 日消息，工商時報昨日（10 月 28 日）發佈博文，報道稱蘋果計劃在其首款摺疊手機、2026 年推出的 iPhone 18 系列上，全面換用其自研的第二代 5G 基帶芯片 C2，不過會繼續採用台積電 4 納米（N4）工藝量產。消息稱蘋果在發佈 iPhone 16e 後不久，便着手研發 C2 芯片，目標是在 iPhone 18 上徹底實現基帶芯片的自給自足。這也意味着 iPhone 17 系列將是最後一代使用高通 5G 基帶的機型。IT之家援引博文介紹，與將採用台積電最新 2 納米工藝的 A20 和 A20 Pro 芯片不同，C2 基帶芯片將採用成熟的 4 納米（N4）工藝進行量產。對於為何選擇舊工藝，天風國際證券分析師郭明錤此前曾作出解釋。他認為，基帶芯片並非智能手機中最耗電的組件，因此對先進製程的需求不如芯片迫切。同時，自研基帶芯片的投資回報率並不高，盲目追求先進工藝也未必能直接帶來傳輸速度的提升。因此，該媒體認為對於蘋果這樣的 4 萬億美元巨頭而言，選擇 4 納米工藝，並非資金問題，更多是出於技術策略和成本效益的綜合考量。該消息源還指出，C2 芯片雖然沿用台積電 N4 工藝，但會成為蘋果首款同時支持毫米波（mmWave）和 Sub-6GHz 兩種 5G 網絡頻段的自研基帶芯片。相較於前代 C1 和 C1X，這一整合將極大地提升網絡連接速度和適用範圍。廣告聲明：文內含有的對外跳轉鏈接（包括不限於超鏈接、二維碼、口令等形式），用於傳遞更多信息，節省甄選時間，結果僅供參考，IT之家所有文章均包含本聲明。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}