蘋果這款芯片，全面取代高通

半導體芯聞

2025/10/29

如果您希望可以時常見面，歡迎標星收藏哦~來源：內容來自半導體芯聞綜合。據報道，iPhone 17 系列將成為蘋果最後一代搭載高通 5G 基帶芯片的機型。蘋果正計劃在 iPhone 18 全繫上全面切換至自研的 C2 基帶芯片。這一自研方案在 iPhone 16e 發布後不久即開始研發，預計將在 2026 年實現量產。不過，最新消息顯示，與蘋果自研的 A20、A20 Pro 等芯片不同，C2 並...

網頁鏈接

免責聲明：投資有風險，本文並非投資建議，以上內容不應被視為任何金融產品的購買或出售要約、建議或邀請，作者或其他用戶的任何相關討論、評論或帖子也不應被視為此類內容。本文僅供一般參考，不考慮您的個人投資目標、財務狀況或需求。TTM對信息的準確性和完整性不承擔任何責任或保證，投資者應自行研究並在投資前尋求專業建議。

熱議股票

{"basename":"/hant","ssrTDKData":{"titleTemplate":"%s - 老虎證券","title":"老虎证券全球投资理财平台| 一站式投资美股新股港股A股","description":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","keywords":"老虎證券,老虎證券開戶,老虎券商,老虎證券官網,老虎證券app,tigertrade老虎證券,股票,炒股,新加坡股票交易平臺,投資,投資理財","social":{"ogDescription":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.be62fbe1.png","ogUrl":"https://www.itiger.com/hant/news/2579972724"},"companyName":"老虎證券"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"SGP","license":"TBSG","edition":"fundamental"},"isCrawlerRequest":true,"__swrFallback__":{"@#url:\"https://stock-news.skytigris.cn/v3/news\",params:#id:\"2579972724\",edition:\"fundamental\",auth_exemption:1,,,undefined,":{"share":"https://ttm.financial/m/news/2579972724?lang=zh_TW&edition=fundamental","thumbnail":"","is_english":false,"pubTime":"2025-10-29 18:40","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2579972724","market":"us","top_or_hot":-1,"title":"蘋果這款芯片，全面取代高通","media":"半導體芯聞","content":"<div>\n<p>如果您希望可以時常見面，歡迎標星 收藏哦~來源：內容來自半導體芯聞綜合。據報道，iPhone 17 系列將成為蘋果最後一代搭載高通 5G 基帶芯片的機型。蘋果正計劃在 iPhone 18 全繫上全面切換至自研的 C2 基帶芯片。這一自研方案在 iPhone 16e 發布後不久即開始研發，預計將在 2026 年實現量產。不過，最新消息顯示，與蘋果自研的 A20、A20 Pro 等芯片不同，C2 並...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251029190011a6d4b062&s=b\">網頁鏈接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>蘋果這款芯片，全面取代高通</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n蘋果這款芯片，全面取代高通\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">半導體芯聞</strong><span class=\"h-time small\">2025-10-29 18:40</span>\n</p>\n</h4>\n</header>\n<article>\n<div>\n<p>如果您希望可以時常見面，歡迎標星 收藏哦~來源：內容來自半導體芯聞綜合。據報道，iPhone 17 系列將成為蘋果最後一代搭載高通 5G 基帶芯片的機型。蘋果正計劃在 iPhone 18 全繫上全面切換至自研的 C2 基帶芯片。這一自研方案在 iPhone 16e 發布後不久即開始研發，預計將在 2026 年實現量產。不過，最新消息顯示，與蘋果自研的 A20、A20 Pro 等芯片不同，C2 並...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251029190011a6d4b062&s=b\">網頁鏈接</a>\n\n</div>\n\n<div class=\"bt-text\">\n\n\n<p> 來源：<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251029190011a6d4b062&s=b\">半導體芯聞</a></p>\n<p>為提升您的閱讀體驗，我們對本頁面進行了排版優化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU1316542783.SGD","symbol_name":"Janus Henderson Horizon Global Technology Leaders A2 SGD","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251029190011a6d4b062&s=b","article_id":"2579972724","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251029190011a6d4b062&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2579972724","pubTimestamp":1761734419,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"據報道，iPhone 17 系列將成為蘋果最後一代搭載高通 5G 基帶芯片的機型。蘋果正計劃在 iPhone 18 全繫上全面切換至自研的 C2 基帶芯片。不過，最新消息顯示，與蘋果自研的 A20、A20 Pro 等芯片不同，C2 並不會採用台積電最新的 2nm 製程工藝，而是基於較早一代的光刻節點製造。儘管蘋果 reportedly 已鎖定了台積電超過一半的首批 2nm 產能，但該製程並不會用於 C2 基帶芯片。據《工商時報》報道，蘋果將繼續採用 4nm N4 工藝打造下一代基帶產品。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","IE00B4JS1V06.HKD":"JANUS HENDERSON BALANCED \"A2\" (HKD) ACC","QCOM":"高通","LU1935043023.USD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME \"AA\" (USD) INC A","LU1242518857.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"I\" (USD) ACC","IE00B775SV38.USD":"NEUBERGER BERMAN US MULTICAP OPPORTUNITIES \"A\" (USD) ACC","IE00BBT3K403.USD":"LEGG MASON CLEARBRIDGE TACTICAL DIVIDEND INCOME \"A(USD) ACC","LU2746668461.USD":"MANULIFE DYNAMIC LEADERS \"AA\" (USD) ACC","LU1291159041.SGD":"CPR Invest - Global Silver Age A2 Acc SGD-H","LU2271345857.HKD":"ALLIANZ GLOBAL SUSTAINABILITY \"AT\" (HKD) ACC","HK0000320264.USD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (USD) ACC","LU2430703095.HKD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4\" (HKD) INC","MACW.SI":"APPLE 3xLongSG261006","LU0314106906.USD":"MANULIFE GF GLOBAL EQUITY \"AA\" (USD) INC","LU2430703178.SGD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4H\" (SGDHDG) INC","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","BK4604":"机器人概念","LU0053666078.USD":"摩根大通基金-美国股票A（离岸）美元","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","LU1582986433.USD":"M&G (LUX) INCOME ALLOCATION \"A-H\" (USDHDG) INC","LU0345768740.USD":"NINETY ONE GSF GLOBAL STRATEGIC MANAGED \"A\" (USD) INC","BK4527":"明星科技股","LU1551013425.SGD":"Allianz Income and Growth Cl AMg2 DIS H2-SGD","LU2430703251.USD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4\" (USD) INC","LU0082616367.USD":"摩根大通美国科技A（dist）","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","LU0795875169.SGD":"JPMorgan Investment Funds - Global Income A (div) SGD-H","AAPL":"苹果","SG9999017495.SGD":"UGDP UNITED GLOBAL QUALITY GROWTH \"B\" (SGD) ACC","LU2756315318.SGD":"ALLIANZ INCOME AND GROWTH \"AMG\" (SGDHDG) INC A","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","TSM":"台积电","LU1035775433.USD":"AB SICAV I - AMERICAN GROWTH PORTFOLIO \"AD\" (USD) INC","BK4571":"数字音乐概念","BK4576":"AR","LU0949170772.SGD":"Blackrock Global Equity Income A6 SGD-H","IE00BLSP4452.SGD":"Legg Mason ClearBridge - Tactical Dividend Income A Mdis SGD-H Plus","LU1003077747.HKD":"BGF GLOBAL EQUITY INCOME \"A6\" (HKDHDG) INC","SG9999002232.USD":"Allianz Global High Payout USD","BK4575":"芯片概念","SG9999014914.USD":"UNITED GLOBAL QUALITY GROWTH (USDHDG) INC","SG9999015341.SGD":"United Income Focus Trust Acc SGD-H","LU0417517546.SGD":"Allianz US Equity Cl AT Acc SGD","LU2083900584.USD":"HSBC GIF US INCOME FOCUSED \"AM2\" (USD) INC","IE0004091025.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"B\" (USD) ACC","SG9999002224.SGD":"Allianz Global High Payout SGD","IE00BJJMRX11.SGD":"Janus Henderson Balanced A Acc SGD","BK4612":"AI芯片","LU0265550946.USD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A5\" (USD) INC","LU0079474960.USD":"联博美国增长基金A","BK4579":"人工智能"},"translate_title":"Apple's chip completely replaces Qualcomm","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"QCOM":1.5,"TSM":0.9,"MACW.SI":0.6,"AAPL":1.5},"content_text":"如果您希望可以時常見面，歡迎標星 收藏哦~來源：內容來自半導體芯聞綜合。據報道，iPhone 17 系列將成為蘋果最後一代搭載高通 5G 基帶芯片的機型。蘋果正計劃在 iPhone 18 全繫上全面切換至自研的 C2 基帶芯片。這一自研方案在 iPhone 16e 發布後不久即開始研發，預計將在 2026 年實現量產。不過，最新消息顯示，與蘋果自研的 A20、A20 Pro 等芯片不同，C2 並不會採用台積電最新的 2nm 製程工藝，而是基於較早一代的光刻節點製造。消息稱，C2 5G 調制解調器將使用台積電4nm「N4」工藝量產。此前有分析師指出，對於這類芯片而言，並沒有強烈動力去採用最新一代製程。儘管蘋果 reportedly 已鎖定了台積電超過一半的首批 2nm 產能，但該製程並不會用於 C2 基帶芯片。據《工商時報》報道，蘋果將繼續採用 4nm N4 工藝打造下一代基帶產品。值得注意的是，當前 iPhone 16e 所使用的 C1 基帶芯片也是基於 4nm 工藝，這表明在該類別中，蘋果並不急於轉向最新 2nm 節點。除成本因素外，蘋果似乎幾乎沒有理由為 C2 切換至 3nm 或 2nm 工藝。作為一家市值數萬億美元的科技巨頭，蘋果並不受限於製造成本，但分析師指出，從性能角度來看，這一轉變意義有限。天風國際證券分析師郭明錤此前表示，基帶芯片並非智能手機中最耗能的元件，而且自研基帶的投資回報率並不高，採用更先進的製程也不一定能顯著提升傳輸速率。不過，C2 相較 C1 與 C1X 的一大優勢在於，它將支持毫米波（mmWave）與 Sub-6GHz 雙模 5G 網絡，這一差異預計將帶來顯著的網絡速率提升。預計包括摺疊屏版 iPhone 在內的 iPhone 18 全系列機型都將搭載 C2 基帶芯片。考慮到 C1X 已經帶來的性能改進，蘋果如何在一年內再次提升體驗，值得關注。至於台積電的 N4 工藝，相較上一代 N5 節點，其性能提升約 5%，晶體管密度增加約 6%。點這裏 加關注，鎖定更多原創內容","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"2","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}