Amkor Technology Showcases Advanced Semiconductor Packaging and Global Expansion in Investor Presentation

Reuters
2025/11/01
Amkor Technology Showcases Advanced Semiconductor Packaging and Global Expansion in Investor Presentation

Amkor Technology Inc. has released a new investor presentation outlining its position as a global provider of semiconductor packaging and test services. The company reported $6.3 billion in revenue for 2024 and highlighted its operations across eight countries, with plans to expand manufacturing in the United States. Amkor emphasized its focus on advanced packaging technologies, which accounted for 82% of its 2024 revenue, and noted a capital expenditure of $744 million for the year. The presentation also detailed Amkor's service offerings, which include design innovation, materials management, wafer processing, package assembly, and final product testing, supporting a broad range of markets such as communications, computing, automotive, and consumer electronics. You can access the full presentation through the link below.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Amkor Technology Inc. published the original content used to generate this news brief on October 31, 2025, and is solely responsible for the information contained therein.

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