Schmid Group Secures Major Orders for Panel Level Packaging and mSAP Production Equipment

Reuters

2025/11/10

Schmid Group Secures Major Orders for Panel Level Packaging and mSAP Production Equipment

Schmid Group NV has announced the successful completion of two major orders in the rapidly growing sectors of Panel Level Packaging (PLP) and modified Semi-Additive Process (mSAP) technology. The company, a global manufacturer and solutions provider for printed circuit board $(PCB)$ and IC substrate production, stated that these orders highlight its role in enabling advanced electronics manufacturing amid increasing demand driven by artificial intelligence $(AI)$ and semiconductor industry growth. According to industry sources cited by Schmid Group, the demand for large-format substrates is rising, with new designs incorporating more High-Bandwidth Memory $(HBM)$ stacks and Co-Packaged Optics (CPO) solutions. The company's advanced process equipment portfolio aims to support scalable and high-yield manufacturing for next-generation packaging technologies.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Schmid Group NV published the original content used to generate this news brief on November 10, 2025, and is solely responsible for the information contained therein.

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{"basename":"/hant","ssrTDKData":{"titleTemplate":"%s - 老虎證券","title":"老虎证券全球投资理财平台| 一站式投资美股新股港股A股","description":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","keywords":"老虎證券,老虎證券開戶,老虎券商,老虎證券官網,老虎證券app,tigertrade老虎證券,股票,炒股,新加坡股票交易平臺,投資,投資理財","social":{"ogDescription":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.be62fbe1.png","ogUrl":"https://www.itiger.com/hant/news/2582269688"},"companyName":"老虎證券"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"SGP","license":"TBSG","edition":"fundamental"},"isCrawlerRequest":true,"__swrFallback__":{"@#url:\"https://stock-news.skytigris.cn/v3/news\",params:#id:\"2582269688\",edition:\"fundamental\",auth_exemption:1,,,undefined,":{"share":"https://ttm.financial/m/news/2582269688?lang=zh_TW&edition=fundamental","thumbnail":"","is_english":true,"pubTime":"2025-11-10 16:59","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2582269688","market":"nz","top_or_hot":-1,"title":"Schmid Group Secures Major Orders for Panel Level Packaging and mSAP Production Equipment","media":"Reuters","content":"<html xmlns=\"http://www.w3.org/1999/xhtml\" xmlns:newsg2=\"http://iptc.org/std/nar/2006-10-01/\" xmlns:xhtml=\"http://www.w3.org/1999/xhtml\"><head><title>\n      Schmid Group Secures Major Orders for Panel Level Packaging and mSAP Production Equipment\n    </title></head><body><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<p>\n        Schmid Group NV has announced the successful completion of two major orders in the rapidly growing sectors of Panel Level Packaging (PLP) and modified Semi-Additive Process (mSAP) technology. The company, a global manufacturer and solutions provider for printed circuit board <a href=\"https://laohu8.com/S/PCB\">$(PCB)$</a> and IC substrate production, stated that these orders highlight its role in enabling advanced electronics manufacturing amid increasing demand driven by artificial intelligence <a href=\"https://laohu8.com/S/AI\">$(AI)$</a> and semiconductor industry growth. According to industry sources cited by Schmid Group, the demand for large-format substrates is rising, with new designs incorporating more High-Bandwidth Memory <a href=\"https://laohu8.com/S/HBM\">$(HBM)$</a> stacks and Co-Packaged Optics (CPO) solutions. The company's advanced process equipment portfolio aims to support scalable and high-yield manufacturing for next-generation packaging technologies.\n      </p>\n</div><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<em>Disclaimer: <span>This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Schmid Group NV published the original content used to generate this news brief on November 10, 2025, and is solely responsible for the information contained therein.</span></em>\n</div></body></html>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Schmid Group Secures Major Orders for Panel Level Packaging and mSAP Production Equipment</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nSchmid Group Secures Major Orders for Panel Level Packaging and mSAP Production Equipment\n</h2>\n<h4 class=\"meta\">\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1032215980\">\n\n<div class=\"h-thumb\" style=\"background-image:url(https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Reuters </p>\n<p class=\"h-time smaller\">2025-11-10 16:59</p>\n</div>\n</a>\n</h4>\n</header>\n<article>\n<html xmlns=\"http://www.w3.org/1999/xhtml\" xmlns:newsg2=\"http://iptc.org/std/nar/2006-10-01/\" xmlns:xhtml=\"http://www.w3.org/1999/xhtml\"><head><title>\n      Schmid Group Secures Major Orders for Panel Level Packaging and mSAP Production Equipment\n    </title></head><body><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<p>\n        Schmid Group NV has announced the successful completion of two major orders in the rapidly growing sectors of Panel Level Packaging (PLP) and modified Semi-Additive Process (mSAP) technology. The company, a global manufacturer and solutions provider for printed circuit board <a href=\"https://laohu8.com/S/PCB\">$(PCB)$</a> and IC substrate production, stated that these orders highlight its role in enabling advanced electronics manufacturing amid increasing demand driven by artificial intelligence <a href=\"https://laohu8.com/S/AI\">$(AI)$</a> and semiconductor industry growth. According to industry sources cited by Schmid Group, the demand for large-format substrates is rising, with new designs incorporating more High-Bandwidth Memory <a href=\"https://laohu8.com/S/HBM\">$(HBM)$</a> stacks and Co-Packaged Optics (CPO) solutions. The company's advanced process equipment portfolio aims to support scalable and high-yield manufacturing for next-generation packaging technologies.\n      </p>\n</div><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<em>Disclaimer: <span>This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Schmid Group NV published the original content used to generate this news brief on November 10, 2025, and is solely responsible for the information contained therein.</span></em>\n</div></body></html>\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"SHMD","symbol_name":"SCHMID GROUP N.V.","start_time":0,"source_url":"https://api.refinitiv.com/data/news/v1/stories/urn:newsml:reuters.com:20251110:nNDL3WDyCB:1","article_id":"2582269688","we_media_id":"1032215980","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2582269688","pubTimestamp":1762765194,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Reuters","introduction":"Reuters.com brings you the latest news from around the world, covering breaking news in markets, business, politics, entertainment and technology","home_visible":1,"id":"1032215980","head_image":"https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48"},"summary":"Schmid Group NV has announced the successful completion of two major orders in the rapidly growing sectors of Panel Level Packaging  and modified Semi-Additive Process  technology. The company, a global manufacturer and solutions provider for printed circuit board  and IC substrate production, stated that these orders highlight its role in enabling advanced electronics manufacturing amid increasing demand driven by artificial intelligence  and semiconductor industry growth. According to industry sources cited by Schmid Group, the demand for large-format substrates is rising, with new designs incorporating more High-Bandwidth Memory  stacks and Co-Packaged Optics  solutions. The company's advanced process equipment portfolio aims to support scalable and high-yield manufacturing for next-generation packaging technologies.Disclaimer: This news brief was created by Public Technologies  using generative artificial intelligence. While PUBT strives to provide accurate and timely information, ","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"en","relate_stocks":{"SHMD":"SCHMID GROUP N.V.","BK4145":"电子制造服务"},"translate_title":"施密德集团获得面板级封装和mSAP生产设备大单","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"SHMD":0.9},"content_text":"Schmid Group Secures Major Orders for Panel Level Packaging and mSAP Production Equipment\n    \n\n        Schmid Group NV has announced the successful completion of two major orders in the rapidly growing sectors of Panel Level Packaging (PLP) and modified Semi-Additive Process (mSAP) technology. The company, a global manufacturer and solutions provider for printed circuit board $(PCB)$ and IC substrate production, stated that these orders highlight its role in enabling advanced electronics manufacturing amid increasing demand driven by artificial intelligence $(AI)$ and semiconductor industry growth. According to industry sources cited by Schmid Group, the demand for large-format substrates is rising, with new designs incorporating more High-Bandwidth Memory $(HBM)$ stacks and Co-Packaged Optics (CPO) solutions. The company's advanced process equipment portfolio aims to support scalable and high-yield manufacturing for next-generation packaging technologies.\n      \n\nDisclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Schmid Group NV published the original content used to generate this news brief on November 10, 2025, and is solely responsible for the information contained therein.","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}