QuickLogic Corporation announced an expansion of its strategic radiation hardened FPGA contract with the U.S. government. The total contract ceiling has been increased to approximately $88 million over multiple years. The scope now includes development using GlobalFoundries' 12LP fabrication process. QuickLogic has completed the design and tape-out of a test chip for this project, which is sponsored by the Department of Defense’s Trusted and Assured Microelectronics Program, with the Naval Surface Warfare Center Crane serving as the technical lead.
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