Hyundai Mobis Co. Ltd. and Qualcomm Technologies Inc. have entered into a comprehensive agreement to collaborate on the development of next-generation Software-Defined Vehicle (SDV) architectures and Advanced Driver Assistance Systems (ADAS). The partnership, formalized through an MOU signed at CES 2026, will see the two companies co-develop advanced driving and parking solutions based on Qualcomm’s Snapdragon Ride Flex system-on-chip (SoC). The collaboration aims to deliver integrated solutions tailored to emerging markets, such as India, where demand for SDV-ready architectures and ADAS is rapidly growing. Beyond ADAS, Hyundai Mobis and Qualcomm plan to expand their joint efforts to broader SDV solutions, leveraging Hyundai Mobis’s expertise in system integration and Qualcomm’s leadership in automotive chip technology.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Hyundai Mobis Co. Ltd. published the original content used to generate this news brief via PR Newswire (Ref. ID: EN54998) on January 07, 2026, and is solely responsible for the information contained therein.